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Small Area X-Ray Fluorescence Analysis of Multilayer Thin Metal Films
Published online by Cambridge University Press: 06 March 2019
Abstract
Thin film technology has become an integral part of semiconductor multichip ceramic packages. Characterizing the thickness of multimetal multilayer thin film structures that combine both thin and thick films is an important parameter for manufacturing process control and development. Accuracies in the range of 3-5% and precisions of 1.3% were attained on multilayer metal films ranging from a few hundred angstroms to tens of thousands of angstroms.
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