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Large-signal modeling of large-size GaN HEMTs with a comprehensive extrinsic elements extraction algorithm

Published online by Cambridge University Press:  23 March 2010

J. Alberto Zamudio-Flores*
Affiliation:
FG Mikrowellenelektronik, University of Kassel, Wilhelmshoeher Allee 73, Kassel D-34121, Germany.
Samir Dahmani
Affiliation:
FG Mikrowellenelektronik, University of Kassel, Wilhelmshoeher Allee 73, Kassel D-34121, Germany.
Günter Kompa
Affiliation:
FG Mikrowellenelektronik, University of Kassel, Wilhelmshoeher Allee 73, Kassel D-34121, Germany.
*
Corresponding author: J. Alberto Zamudio-Flores Email: zamudio@uni-kassel.de

Abstract

This work presents a measurement-based physics-oriented large-signal modeling technique for GaN HEMTs. All the model elements are derived directly from pulsed-DC measurements and bias dependent small-signal model elements. The proposed small-signal model features a 12-element extrinsic network, which allows proper modeling of the complex parasitic effects present in large gate-width devices. A reliable generally applicable extrinsic extraction algorithm is presented. It is based on pinch-off S-parameter measurements and on a scanning procedure to find the optimal capacitance distribution. Results of applying the algorithm with measured data of a GaN HEMT with gate width of 3.2-mm prove the consistency of the formulation. Successful model verification is shown under pulsed-DC, single- and two-tone operations, showing accurate predictions versus measurements of IDS, Pout, gain, harmonics and IMD products.

Type
Original Article
Copyright
Copyright © Cambridge University Press and the European Microwave Association 2010

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References

REFERENCES

[1]Sheppard, S.T. et al. : High-power microwave GaN/AlGaN HEMTs on semi-insulating silicon carbide substrates. IEEE Electron Device Lett., 20 (1999), 161163.CrossRefGoogle Scholar
[2]Lee, C.; Saunier, P.; Jinwei, Y.; Khan, M.A.: AlGaN-GaN HEMTs on SiC with CW power performance of >4 W/mm and 23% PAE at 35 GHz. IEEE Electron Device Lett., 24 (2003), 616618.CrossRefGoogle Scholar
[3]Wu, Y.-F. et al. : 30-W/mm GaN HEMTs by field plate optimization. IEEE Electron Device Lett., 25 (2004), 117119.CrossRefGoogle Scholar
[4]Burm, J., Schaff, W.J., Eastman, L.F., Amano, H., Akasaki, I.: An improved small-signal equivalent circuit model for III-V nitride MODFET's with large contact resistances. IEEE Trans. Electron Device, 44 (1997), 906907.CrossRefGoogle Scholar
[5]Zarate-de Landa, A.; Zuniga-Juarez, J.; Loo-Yau, J.; Reynoso-Hernandez, J.; Maya-Sanchez, M.; del Valle-Padilla, J.: Advances in linear modeling of microwave transistors. IEEE Microwave Mag., 10 (2009), 100, 102–111, 146.CrossRefGoogle Scholar
[6]Jarndal, A.; Kompa, G.: A new small-signal modeling approach applied to GaN devices. IEEE Trans. Microwave Theory Tech., 53 (2005), 34403448.CrossRefGoogle Scholar
[7]Crupi, G. et al. : Accurate multibias equivalent-circuit extraction for GaN HEMTs. IEEE Trans. Microwave Theory Tech., 54 (2006), 36163622.CrossRefGoogle Scholar
[8]Chigaeva, E. et al. : Determination of small-signal parameters of GaN-based HEMTs, in Proc. IEEE/Cornell Conf. on High Performance Devices, 2000, 115122.Google Scholar
[9]Chen, G., Kumar, V., Schwindt, R.S.; Adesida, I.: A low gate bias model extraction technique for AlGaN/GaN HEMTs. IEEE Trans. Microwave Theory Tech., 54 (2006), 29492953.CrossRefGoogle Scholar
[10]Brady, R.G.; Oxley, C.H.; Brazil, T.J.: An improved small-signal parameter-extraction algorithm for GaN HEMT devices. IEEE Trans. Microwave Theory Tech., 56 (2008), 15351544.CrossRefGoogle Scholar
[11]Nuttinck, S.; Gebara, E.; Laskar, J.; Shealy, J.; Harris, M.: Improved RF modeling techniques for enhanced AlGaN/GaN HFETs. IEEE Microwave Wirel. Compon. Lett., 13 (2003), 140142.CrossRefGoogle Scholar
[12]Caddemi, A.; Crupi, G.; Donato, N.: Microwave characterization and modeling of packaged HEMTs by a direct extraction procedure down to 30 K. IEEE Trans. Instrum. Meas., 55 (2006), 465470.CrossRefGoogle Scholar
[13]Kompa, G.; Novotny, M.: Frequency-dependent measurement error analysis and refined FET model parameter extraction including bias-dependent series resistors, in Int. IEEE Workshop on Experimentally Based FET Device Modeling & Related Nonlinear Circuit Design, Kassel University, Department of High Frequency Engineering, July 1997, 6.16.16.Google Scholar
[14]Kompa, G.: Modeling of dispersive microwave FET devices using a quasi-static approach. Int. J. Microwave Millimeter Wave CAE, 5 (1995), 173194.Google Scholar
[15]ADS 2008 Update 1. Advanced Design System, Agilent Technologies, Reference Manual, 2008.Google Scholar
[16]Filicori, F.; Vannini, G.; Santarelli, A.; Sanchez, A.M.; Tazon, A.; Newport, Y.: Empirical modeling of low-frequency dispersive effects due to traps and thermal phenomena in III-V FET's. IEEE Trans. Microwave Theory Tech., 43 (1995), 29722981.CrossRefGoogle Scholar
[17]Dahmani, S.; Mengistu, E.S.; Kompa, G.: Electro-thermal modeling of large-size GaN HEMTs, in German Microwave Conf., Hamburg, March 10–12, 2008.Google Scholar
[18]Filippov, K.A.; Balandin, A.A.: Self-heating effects in GaN/AlGaN heterostructure field-effect transistors and device structure optimization. Nanotech, 3 (2003), 333336. www.nsti.org, ISBN 0-9728422-2-5.Google Scholar
[19]Dahmani, S.; Mengistu, E.S.; Kompa, G.: Thermal model extraction of GaN HEMTs for large-signal modeling, in Third European Microwave Integrated Circuit Conf., Amsterdam, October 27–28, 2008, 226229.CrossRefGoogle Scholar