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Moving contact line on chemically patterned surfaces

Published online by Cambridge University Press:  23 May 2008

XIAO-PING WANG
Affiliation:
Department of Mathematics, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China
TIEZHENG QIAN
Affiliation:
Department of Mathematics, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China
PING SHENG
Affiliation:
Department of Physics and Institute of Nano Science and Technology, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China

Abstract

We simulate the moving contact line in two-dimensional chemically patterned channels using a diffuse-interface model with the generalized Navier boundary condition. The motion of the fluid–fluid interface in confined immiscible two-phase flows is modulated by the chemical pattern on the top and bottom surfaces, leading to a stick–slip behaviour of the contact line. The extra dissipation induced by this oscillatory contact-line motion is significant and increases rapidly with the wettability contrast of the pattern. A critical value of the wettability contrast is identified above which the effect of diffusion becomes important, leading to the interesting behaviour of fluid–fluid interface breaking, with the transport of the non-wetting fluid being assisted and mediated by rapid diffusion through the wetting fluid. Near the critical value, the time-averaged extra dissipation scales as U, the displacement velocity. By decreasing the period of the pattern, we show the solid surface to be characterized by an effective contact angle whose value depends on the material characteristics and composition of the patterned surfaces.

Type
Papers
Copyright
Copyright © Cambridge University Press 2008

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