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Abnormal grain growth of sputtered CuNi(Mn) thin films

Published online by Cambridge University Press:  31 January 2011

W. Brückner ,
V. Weihnacht ,
W. Pitschke ,
J. Thomas  and
S. Baunack
W. Brückner
Affiliation:
Institute of Solid State and Materials Research Dresden, D-01171 Dresden, Germany
V. Weihnacht
Affiliation:
Institute of Solid State and Materials Research Dresden, D-01171 Dresden, Germany
W. Pitschke
Affiliation:
Institute of Solid State and Materials Research Dresden, D-01171 Dresden, Germany
J. Thomas
Affiliation:
Institute of Solid State and Materials Research Dresden, D-01171 Dresden, Germany
S. Baunack
Affiliation:
Institute of Solid State and Materials Research Dresden, D-01171 Dresden, Germany
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Abstract

The evolution in both stress and microstructure was investigated on sputtered Cu0.57Ni0.42Mn0.01 thin films of 400 nm thickness during the first temperature cycle up to 550 °C. Samples from stress–temperature measurements up to various maximum temperatures were analyzed by x-ray diffraction, scanning and transmission electron microscopy, and Auger electron spectroscopy. The columnar grains with lateral diameters of about 20 nm in the as-deposited state coarsen to about 400 nm above 300 °C. Probably due to the impurity (Mn) drag effect, the coarsening occurs by abnormal grain growth rather than by normal grain growth, starting near the film–substrate interface. The stress development results from a combination of densification due to grain growth and plastic stress relaxation.

Type
Articles
Information
Journal of Materials Research , Volume 15 , Issue 5 , May 2000 , pp. 1062 - 1068
Copyright
Copyright © Materials Research Society 2000

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References

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