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Depth-sensing indentation response of ordered silica foam

Published online by Cambridge University Press:  03 March 2011

Yvete Toivola ,
Andreas Stein  and
Robert F. Cook
Yvete Toivola
Affiliation:
Department of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, Minnesota 55455
Andreas Stein
Affiliation:
Department of Chemistry, University of Minnesota, Minneapolis, Minnesota 55455
Robert F. Cook
Affiliation:
Department of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, Minnesota 55455
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Abstract

Depth-sensing indentation was applied to three-dimensionally ordered silica foams of two different pore diameters—500 nm and 850 nm—formed by colloidal crystal templating. The contact responses of indentations with Berkovich and hemispherical indentation tips are presented over a load range of 1 mN to 100 mN. Scanning electron microscopy images of residual indentation impressions showed homogeneous deformation for small loads in which the peak displacement was shallow relative to the film–substrate interface. The characteristics of the load–displacement responses changed from periodic discontinuities, associated with cell wall fracture and pore collapse, to smooth and increased stiffness, as a result of densification due to the accumulation of material under the indentation tip and proximity (and contact) of the substrate. Load–displacement responses were translated into pressure–volume space, in which the average pressure during indentation is a measure of the crushing pressure of the cell walls.

Keywords

NanoindentationPorosityCellular
Type
Articles
Information
Journal of Materials Research , Volume 19 , Issue 1 , January 2004 , pp. 260 - 271
Copyright
Copyright © Materials Research Society 2004

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References

REFERENCES

1.Blanford, C.F., Yan, H., Schroden, R.C., Al-Daous, M. and Stein, A., Adv. Mater. 13 401 (2001).3.0.CO;2-7>CrossRefGoogle Scholar
2.Stein, A., Microporous and Mesoporous Materials 44–45 227 (2001).CrossRefGoogle Scholar
3.Holland, B.T., Blanford, C.F., Do, T. and Stein, A., Chem. Mater. 11 795 (1999).CrossRefGoogle Scholar
4.Yan, H., Blanford, D.F., Lytle, J.C., Carter, C.B., Smyrl, W.H. and Stein, A., Chem. Mater. 13 4314 (2001).CrossRefGoogle Scholar
5.Yan, H., Blanford, C.F., Holland, B.T., Smyrl, W.H. and Stein, A., Chem. Mater. 12 1134 (2000).CrossRefGoogle Scholar
6.Schroden, R.C., Al-Daous, M., Blanford, C.F. and Stein, A., Chem. Mater. 14 3305 (2002).CrossRefGoogle Scholar
7.Schroden, R.C., Al-Daous, M., Sokolov, S., Melde, B.J., Lytle, J.C., Stein, A., Carbajo, M.C., Fernández, J.T. and Rodríguez, E.E., J. Mater. Chem. 12 3261 (2002).CrossRefGoogle Scholar
8.Yan, H., Zhang, K., Blanford, C.F., Francis, L.F. and Stein, A., Chem. Mater. 13 1374 (2001).CrossRefGoogle Scholar
9.Hayward, R.C., Alberius-Henning, P., Chmelka, B.F. and Stucky, G.D., Microporous and Mesoporous Materials 44–45 619 (2001).CrossRefGoogle Scholar
10.Scandella, L., Binder, G., Mezzacasa, T., Gobrecht, J., Berger, R., Lang, H.P., Gerber, Ch., Gimzewski, J.K., Koegler, J.H. and Jansen, J.C., Microporous and Mesoporous Materials 21 403 (1998).CrossRefGoogle Scholar
11.Thurn, J., Cook, R.F., Kamarajugadda, M. and Stearns, L.C. in Thin Films: Stresses and Mechanical Properties IX, edited by Ozkan, C.S., Freund, L.B., Cammarata, R.C., and Gao, H. (Mater. Res. Soc. Symp. Proc. 695, Warrendale, PA, 2002), p. 91.Google Scholar
12.Toivola, Y., Thurn, J. and Cook, R.F., J. Electrochem. Soc. 149 F9 (2002).CrossRefGoogle Scholar
13.Morris, D. and Cook, R. F. in Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics, edited by McKerrow, A.J., Lew, J., Kraft, O., and Kikkawa, T. (Mater. Res. Soc. Symp. Proc., 766, Warrendale, PA, 2003) pp. 165–170.Google Scholar
14.Bahr, D.F., Wright, J.S., Francis, L.F., Moody, N.R. and Gerberich, W.W. in Materials for Mechanical and Optical Microsystems, edited by Reed, M.L., Elwenspoek, M., Johansson, S., Obermeier, E., Fujita, H., and Uenishi, Y. (Mater. Res. Soc. Symp. Proc. 444, Pittsburgh, PA, 1997), p. 209Google Scholar
15.Alguero, M., Bushby, A.J., Reece, M.J., Calzada, M.L. and Pardo, L., Integrated Ferroelectrics 32 775/83 (2001).CrossRefGoogle Scholar
16.Li, X. and Bhushan, B., Thin Solid Films. 398–399 313 (2001).CrossRefGoogle Scholar
17.Tulliani, J-M., Montanaro, L., Bell, T.J. and Swain, M.V., J. Am. Ceram. Soc. 82 961 (1999).CrossRefGoogle Scholar
18.Gibson, L.J. and Ashby, M.F.Cellular Solids: Structure and Properties, Second ed. (Cambridge University Press, Cambridge, 1997).CrossRefGoogle Scholar
19.Latella, B.A., O’Connor, B.H., Padture, N.P. and Lawn, B.R., J. Am. Ceram. Soc. 80 1027 (1997).CrossRefGoogle Scholar
20.Goodwin, J.W., Ottewill, R.H., Pelton, R., Vianello, G. and Yates, D.E., Br. Polym. J. 10 173 (1978).CrossRefGoogle Scholar
21.Zou, D., Ma, S., Guan, R., Park, M., Sun, L., Aklonis, J.J. and Salovey, R., J. Polym. Sci. Part A: Polym. Chem. 30 137 (1992).CrossRefGoogle Scholar
22.Jiang, P., Bertone, J.F., Hwang, K.S. and Colvin, V.L., Chem. Mater. 11 2132 (1999).CrossRefGoogle Scholar
23.Cook, R.F. and Pharr, G.M., J. Am. Ceram. Soc. 73 787 (1990).CrossRefGoogle Scholar
24.Suarez-Rivera, F.R., Cook, N.G.W., Cooper, G.A. and Zheng, Z. in Rock Mechanics Contributions and Challenges, edited by Hustrulid, W.A. and Johnson, G.A. (Proceedings of the 31st U.S. Symposium in Golden, CO, A. A. Balkema Publishers, Rotterdam, The Netherlands, 1990), p. 671.Google Scholar
25.Leite, M.H. and Ferland, F., Engineering Geology 59 267 (2001).CrossRefGoogle Scholar
26.Oliver, W.C. and Pharr, G.M., J. Mater. Res. 7 1564 (1992).CrossRefGoogle Scholar
27.Doerner, M. and Nix, W., J. Mater. Res. 1 601 (1986).CrossRefGoogle Scholar
28.Menčík, J., Munz, D., Quandt, E., Weppelmann, E.R., Swain, M.V.. J. Mater. Res. 12 2475 (1997).CrossRefGoogle Scholar
29.Fleck, N.A., Otoyo, H. and Onck, P.R., Int. J. Solids Struct. 29 1613 (1992).CrossRefGoogle Scholar
30.Olurin, O.B., Fleck, N.A. and Ashby, M.F., Scr. Mater. 43 983 (2000).CrossRefGoogle Scholar