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Early stage soldering reaction and interfacial microstructure formed between molten Sn–Zn–Ag solder and Cu substrate

Published online by Cambridge University Press:  03 March 2011

Chang-Ho Yu  and
Kwang-Lung Lin
Chang-Ho Yu
Affiliation:
Department of Materials Science and Engineering, National Cheng-Kung University, Tainan, Taiwan 701, Republic of China
Kwang-Lung Lin*
Affiliation:
Department of Materials Science and Engineering, National Cheng-Kung University, Tainan, Taiwan 701, Republic of China
*
a)Address all correspondence to this author. e-mail: matkllin@mail.ncku.edu.tw
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Abstract

The soldering reaction and interfacial microstructure formed between liquid Sn–Zn–Ag solder and Cu at the early stage of soldering at 250 °C for 15 s were studied primarily with the aid of transmission electron microscope (TEM). To achieve the early stage reaction information, the soldered specimens, 5 mm × 5 mm × 500 μm solder on 10 mm × 10 mm × 20 μm Cu, were rapidly quenched in liquid nitrogen after soldering. The results of TEM interfacial analysis show that a Cu–Zn reaction zone, consisting of β′–CuZn and γ–Cu5Zn8, formed near Cu while a Ag–Zn zone, consisting of γ–Ag5Zn8 and ϵ–AgZn3, formed near solder. The innermost layer adjacent to the Cu substrate is an amorphous Cu-Zn diffusion region that contains dispersed β′–CuZn nanocrystalline cells. The β′–CuZn also precipitates in the γ–Ag5Zn8 and ϵ–AgZn3 layer due to the supersaturation of Cu.

Keywords

MicrostructureRapid solidification
Type
Articles
Information
Journal of Materials Research , Volume 20 , Issue 5 , May 2005 , pp. 1242 - 1249
Copyright
Copyright © Materials Research Society 2005

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