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Effect of Cu addition on interfacial reactions between Sn-9Zn lead-free solder and Ni substrate

Published online by Cambridge University Press:  31 January 2011

Yee-wen Yen  and
Wei-kai Liou
Yee-wen Yen*
Affiliation:
Graduate Institute of Materials Science and Technology, National Taiwan University of Science and Technology, Taipei 10672, Taiwan, Republic of China
Wei-kai Liou
Affiliation:
Graduate Institute of Materials Science and Technology, National Taiwan University of Science and Technology, Taipei 10672, Taiwan, Republic of China
*
a)Address all correspondence to this author. e-mail: ywyen@mail.ntust.edu.tw
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Abstract

This study investigates interfacial reactions of (Sn–9Zn) + xCu/Ni systems. Ni5Zn21, Cu5Zn8, (Ni,Zn,Cu)3Sn4, (Cu,Ni,Zn)6Sn5, and Cu6Sn5 phases were formed on the Sn–9Zn/Ni interface at 240–270 °C, when 0–10 wt% Cu was added to the Sn–9Zn solder. Experimental results indicate that changing the concentration of Cu in the Sn–9Zn solder dramatically changes the formation of intermetallic compounds (IMCs) in the (Sn–9Zn) + xCu/Ni system. Different diffusion and segregation rates of elements are the main reasons for a change in the IMC evolution.

Keywords

DiffusionPackagingSoldering
Type
Articles
Information
Journal of Materials Research , Volume 22 , Issue 10 , October 2007 , pp. 2663 - 2667
Copyright
Copyright © Materials Research Society 2007

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References

REFERENCES

1Suganuma, K.Niihara, K.: Wetting and interface microstructure between Sn–Zn binary alloys and Cu. J. Mater. Res. 13, 2859 1998CrossRefGoogle Scholar
2Huang, C.W.Lin, K.L.: Interfacial reactions of lead-free Sn-Zn based solders on Cu and Cu plated electroless Ni–P/Au layer under aging at 150 °C. J. Mater. Res. 19, 3560 2004CrossRefGoogle Scholar
3Song, J.M., Liu, P.C., Shih, C.L.Lin, K.L.: Role of Ag in the formation of interfacial intermetallic phases in Sn–Zn soldering. J. Electron. Mater. 34, 1249 2005CrossRefGoogle Scholar
4Suganuma, K., Murata, T., Noguchi, H.Toyoda, Y.: Heat resistance of Sn–9Zn solder/Cu interface with or without coating. J. Mater. Res. 15, 884 2000CrossRefGoogle Scholar
5Kim, K.S., Yang, J.M., Yu, C.H., Jung, I.O.Kim, H.H.: Analysis on interfacial reactions between Sn–Zn solders and the Au/Ni electrolytic-plated Cu pad. J. Alloy. Compd. 379, 314 2004CrossRefGoogle Scholar
6Yu, D.Q., Xie, H.P.Wang, L.: Investigation of interfacial microstructure and wetting property of newly developed Sn–Zn–Cu solders with Cu substrate. J. Alloy. Compd. 385, 119 2004CrossRefGoogle Scholar
7Chou, C.Y., Chen, S.W.Chang, Y.S.: Interfacial reactions in the Sn–9Zn–(xCu)/Cu and Sn–9Zn–(xCu)/Ni couples. J. Mater. Res. 21, 1849 2006CrossRefGoogle Scholar
8Yen, Y.W., Jao, C.C.Lee, C.: Effect of Cu addition on interfacial reaction between Sn-9Zn solder and Ag J. Mater. Res. 21, 2986 2006CrossRefGoogle Scholar
9Luo, W.C., Ho, C.E., Tsai, J.Y., Liu, Y.L.Kao, C.R.: Solid-state reactions between Ni and Sn–Ag–Cu solders with different Cu concentrations. J. Mater. Sci. Eng., A 396, 385 2005CrossRefGoogle Scholar
10Ho, C.E., Lin, Y.W., Yang, S.C., Kao, C.R.Jinang, D.S.: Effects of limited Cu supply on soldering reactions between SnAgCu and Ni. J. Electron. Mater. 35, 1017 2006CrossRefGoogle Scholar
11Okamoto, H.: Binary Phase Diagram ASM International Materials Park, OH 1990Google Scholar
12Dyson, B.F., Anthony, T.R.Turnbull, D.: Interstitial diffusion of copper in tin. J. Appl. Phys. 38, 1479 1967CrossRefGoogle Scholar