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Effects of electrochemical hydrogen charging on lead-based relaxor ferroelectric multilayer ceramic capacitors

Published online by Cambridge University Press:  31 January 2011

Wanping Chen
Affiliation:
Department of Materials Science and Engineering, Tsinghua University, Beijing 100084, China
Longtu Li
Affiliation:
Department of Materials Science and Engineering, Tsinghua University, Beijing 100084, China
Yu Wang
Affiliation:
Department of Materials Science and Engineering, Tsinghua University, Beijing 100084, China
Zhilun Gui
Affiliation:
Department of Materials Science and Engineering, Tsinghua University, Beijing 100084, China
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Abstract

Lead-based relaxor ferroelectric multilayer ceramic capacitors (MLC's) were placed in 0.05 M NaOH solution to evolve hydrogen on their silver termination electrode by electrolysis of water. After this treatment, the MLC's failed as their insulation resistance was greatly decreased, their dielectric loss was considerably increased, and their capacitance was obviously decreased. By annealing in air at 650 °C for 30 min, the properties of the MLC's were restored. It is proposed that electrochemically generated hydrogen atoms can diffuse into the ceramic body of MLC's and undergo reduction to it, which may be one of the reasons for the negative influence of electroplating on lead-based relaxor ferroelectric MLC's.

Type
Articles
Copyright
Copyright © Materials Research Society 1998

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References

1.Behm, D. A., Feltz, C. J., Haynes, R., and Pinault, S. C., J. Am. Ceram. Soc. 72 (12), 2279 (1989). J. Mater. Res., Vol. 13, No. 5, May 1998 1111 CommunicationsGoogle Scholar
2.Rao, R. M. V., Halliyal, A., and Umarji, A. M., J. Am. Ceram. Soc. 79 (1), 257 (1996).CrossRefGoogle Scholar
3.Wang, Y., Gui, Z. L., Chan, Y. C., Li, L. T., and Zhang, X. W., J. Mater. Sci.: Mater. in Electronics 7, 133 (1996).Google Scholar
4.Moore, A., Electronic Production 18 (2), 25 (1989).Google Scholar
5.Raub, C. J., Plating and Surface Finishing 80 (9), 30 (1993).Google Scholar
6.Wanping, C., Longtu, L., and Zhilun, G., J. Mater. Res. 12, 877 (1997).CrossRefGoogle Scholar
7.Okinaka, Y. and Strschi, H. K., J. Electrochem. Soc. 133 (12), 2608 (1986).CrossRefGoogle Scholar
8.Lagrange, A., Mater. Sci. & Engrg. A109, 113 (1989).CrossRefGoogle Scholar
9.Chang, D. D. and Ling, H. C., IEEE Trans. Component, Hybrid, & Manufacturing, Technol. 12 (2), 310 (1989).CrossRefGoogle Scholar
10.Estreicher, S. K., Mater. Sci. & Engrg. R14, 319 (1995).CrossRefGoogle Scholar