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Electrodeposition of eutectic Sn–Zn alloy by pulse plating

Published online by Cambridge University Press:  31 January 2011

Kwang-Lung Lin  and
Li-Min Sun
Kwang-Lung Lin*
Affiliation:
Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan 701, Republic of China
Li-Min Sun
Affiliation:
Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan 701, Republic of China
*
a) e-mail: matkllin@mail.ncku.edu.tw
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Abstract

A uniform deposition of a Sn–Zn alloy deposit was achieved by pulse plating. Apparently, the relative composition of Sn and Zn in the deposit was affected by the bath compositions and pulse condition. A pulse-plating condition of 99.9 ms on-time and 1.0 ms off-time gave rise to a eutectic Sn–Zn deposit, with a eutectic temperature of 198.8 °C (as analyzed by differential scanning calorimetry) and a uniform composition distribution across the deposit. A mechanism for explaining the pulse-deposition behavior of the Sn–Zn eutectic deposit was proposed. A longer off-time period, 99.9 ms versus 0.1 ms, resulted in a nodular, yet thinner deposit.

Type
Articles
Information
Journal of Materials Research , Volume 18 , Issue 9 , September 2003 , pp. 2203 - 2207
Copyright
Copyright © Materials Research Society 2003

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References

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