Hostname: page-component-7479d7b7d-k7p5g Total loading time: 0 Render date: 2024-07-12T14:17:50.416Z Has data issue: false hasContentIssue false
  • English
  • Français

Electromigration and thermomigration behavior of flip chip solder joints in high current density packages

Published online by Cambridge University Press:  31 January 2011

D. Yang ,
Y.C. Chan ,
B.Y. Wu  and
M. Pecht
D. Yang
Affiliation:
Department of Electronic Engineering, City University of Hong Kong, Kowloon Tong, Hong Kong
Y.C. Chan*
Affiliation:
Department of Electronic Engineering, City University of Hong Kong, Kowloon Tong, Hong Kong
B.Y. Wu
Affiliation:
Department of Electronic Engineering, City University of Hong Kong, Kowloon Tong, Hong Kong
M. Pecht
Affiliation:
Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park, Maryland 20742
*
a)Address all correspondence to this author. e-mail: eeycchan@cityu.edu.hk
Get access

Abstract

The electromigration and thermomigration behavior of eutectic tin-lead flip chip solder joints, subjected to currents ranging from 1.6 to 2.0 A, at ambient temperatures above 100 °C, was experimentally and numerically studied. The temperature at the chip side was monitored using both a temperature coefficient of resistance method and a thermal infrared technique. The electron wind force and thermal gradient played the dominant role in accelerated atomic migration. The atomic flux of lead due to electromigration and thermomigration was estimated for comparison. At the current crowding region, electromigration induced a more serious void accumulation as compared with thermomigration. Also, because of different thermal dissipations, a morphological variation was detected at different cross-sectional planes of the solder joint during thermomigration.

Keywords

DiffusionElectromigrationMicrostructure
Type
Articles
Information
Journal of Materials Research , Volume 23 , Issue 9 , September 2008 , pp. 2333 - 2339
Copyright
Copyright © Materials Research Society 2008

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1International Technology Roadmap for Semiconductors Assembly and Packaging Section Semiconductor Industry Association San Jose, CA 2006 2Google Scholar
2Brandenburg, S.Yeh, S.: Electromigration studies of flip chip bump solder joints in Proceedings of the Surface Mount International Conference and Exhibition SMI San Jose, CA 1998 337Google Scholar
3Tu, K.N.: Recent advances on electromigration in very-large-scale-integration of interconnects. J. Appl. Phys. 94, 5451 2003CrossRefGoogle Scholar
4Rinne, G.A.: Issues in accelerated electromigration of solder bumps. Microelectron. Relia. 43, 1975 2003Google Scholar
5Lin, M.H.Basaran, C.: Electromigration induced stress analysis using fully coupled mechanical-diffusion equations with nonlinear material properties. Comput. Mater. Sci. 34, 82 2005CrossRefGoogle Scholar
6Chiang, K.N., Lee, C.C.Chen, K.M.: Current crowding-induced electromigration in SnAg3.0Cu0.5 microbumps. Appl. Phys. Lett. 88, 072102 2006CrossRefGoogle Scholar
7Zhang, L.Y., Ou, S.Q., Huang, J., Tu, K.N., Gee, S.Luu, N.: Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints. Appl. Phys. Lett. 88, 012106 2006CrossRefGoogle Scholar
8Chiu, S.H., Shao, T.L., Chen, C., Yao, D.J.Hsu, C.Y.: Infrared microscopy of hot spots induced by Joule heating in flip-chip SnAg solder joints under accelerated electromigration. Appl. Phys. Lett. 88, 022110 2006CrossRefGoogle Scholar
9Ye, H., Basaran, C.Hopkins, D.C.: Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing. Appl. Phys. Lett. 82, 1045 2003CrossRefGoogle Scholar
10Huang, A.T., Gusak, A.M., Tu, K.N.Lai, Y.S.: Thermomigration in SnPb composite flip chip solder joints. Appl. Phys. Lett. 88, 141911 2006CrossRefGoogle Scholar
11Yang, D., Alam, M.O., Wu, B.Y.Chan, Y.C.: Thermomigration in eutectic tin-lead flip chip solder joints in Proceedings of the 8th Electronics Packaging Technology Conference (IEEE, Singapore, 2006), p. 565,CrossRefGoogle Scholar
12Yang, D., Wu, B.Y., Chan, Y.C.Tu, K.N.: Microstructural evolution and atomic transport by thermomigration in eutectic tin-lead flip chip solder joints. J. Appl. Phys. 102, 012716 2007CrossRefGoogle Scholar
13Hsiao, H.Y.Chen, C.: Thermomigration in flip-chip SnPb solder joints under alternating current stressing. Appl. Phys. Lett. 90, 152105 2007CrossRefGoogle Scholar
14Ramanathan, L.N., Lee, T.Y., Jang, J.W., Chae, S.H.Ho, P.S.: Current carrying capability of Sn0.7Cu solder bumps in flip chip modules for high-power applications in Proceedings of the 57th Electronics Components and Technology Conference. (IEEE, Reno, Nevada, 2007), p. 1456,Google Scholar
15Agarwal, R., Ou, S.Q.Tu, K.N.: Electromigration and critical product in eutectic SnPb solder lines at 100 °C. J. Appl. Phys. 100, 024909 2006CrossRefGoogle Scholar
16Nah, J.W., Kim, J.H., Lee, H.M.Paik, K.W.: Electromigration in flip chip solder bump of 97Pb3Sn/37Pb63Sn combination structure. Acta Mater. 52, 129 2004CrossRefGoogle Scholar
17Yoon, M.S., Lee, S.B., Kim, O.H., Park, Y.B.Joo, Y.C.: Relationship between edge drift and atomic migration during electromigration of eutectic SnPb lines. J. Appl. Phys. 100, 033715 2006Google Scholar
18Gupta, D., Vieregge, K.Gust, W.: Interface diffusion in eutectic Pb–Sn solder. Acta Mater. 47, 5 1999Google Scholar
19Nah, J.W., Paik, K.W., Suh, J.O.Tu, K.N.: Mechanism of electromigration-induced failure in the 97Pb3Sn and 37Pb63Sn composite solder joints. J. Appl. Phys. 94, 7560 2003CrossRefGoogle Scholar
20Yeh, E.C.C., Choi, W.J.Tu, K.N.: Current-crowding-induced electromigration failure in flip chip solder joints. Appl. Phys. Lett. 80, 580 2002Google Scholar
21Pecht, M.G., Agarwal, R., Mccluskey, P., Dishongh, T., Javadpour, S.Mahajan, R.: Electronic Packaging: Materials and Their Properties CRC Press LLC Boca Raton, FL 1999 25Google Scholar
22Liang, S.W., Shao, T.L., Chen, C., Yeh, C.C.Tu, K.N.: Relieving the current crowding effect in flip chip solder joints during current stressing. J. Mater. Res. 21, 137 2006Google Scholar
23Chuang, Y.C.Liu, C.Y.: Thermomigration in eutectic SnPb alloy. Appl. Phys. Lett. 88, 174105 2006CrossRefGoogle Scholar
24Ouyang, F.Y., Tu, K.N., Lai, Y.S.Gusak, A.M.: Effect of entropy production on microstructure change in eutectic SnPb flip chip solder joints by thermomigration. Appl. Phys. Lett. 89, 221906 2006CrossRefGoogle Scholar
25Huang, A.T., Tu, K.N.Lai, Y.S.: Effect of the combination of electromigration and thermomigration on phase migration and partial melting in flip chip composite SnPb solder joints. J. Appl. Phys. 100, 033512 2006CrossRefGoogle Scholar
26Tu, K.N.: Solder Joint Technology: Materials, Properties, and Reliability Springer Science + Business Media LLC New York 2007 335Google Scholar
27Choi, W.J., Yeh, E.C.C.Tu, K.N.: Mean-time-to-failure study of flip chip solder joints on CuNi(V)Al thin-film under bump metallization. J. Appl. Phys. 94, 5665 2006CrossRefGoogle Scholar
28Shewmon, P.: Diffusion in Solids TMS Warrendale, PA 1989 223Google Scholar