Hostname: page-component-5c6d5d7d68-wbk2r Total loading time: 0 Render date: 2024-08-07T09:13:20.687Z Has data issue: false hasContentIssue false

Filament formation in switching devices based on V2O5 gel films

Published online by Cambridge University Press:  31 January 2011

J-G. Zhang
Affiliation:
National Renewable Energy Laboratory, Golden, Colorado 80401-3393
P.C. Eklund
Affiliation:
Department of Physics & Astronomy and Center for Applied Energy Research, University of Kentucky, Lexington, Kentucky 40506
Get access

Abstract

Filament formation in V2O5 gel films leading to a two-terminal switching device has been observed. In a previous paper, we have identified the switching with a metal-insulator transition within a permanent, current-induced channel between the electrical contacts. Here, we describe the reversible formation of a filament inside the channel, and obtain a static solution of the heat transport equation for this device which indicates a large temperature variation within the filament, and further reveals the failure mechanism for the reversible switching. The principle of least entropy production has been used to analyze the filament growth, which results in a successful simulation of the “on” state I-V characteristic of the switching process, including its negative resistance region.

Type
Articles
Copyright
Copyright © Materials Research Society 1993

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1Bullot, J. and Livage, J., French patent 81, 13665 (1981).Google Scholar
2Bullot, J., Gallais, O., Gauthier, M., and Livage, J., Phys. Status Solidi A 71, k (1982).CrossRefGoogle Scholar
3Zhang, J. G. and Eklund, P. C., J. Appl. Phys. 64 (2), 729 (1988).CrossRefGoogle Scholar
4Tyler, W.W., Phys. Rev. 96, 226 (1954).Google Scholar
5Lampert, M.A., Phys. Rev. 125, 126 (1962).CrossRefGoogle Scholar
6Lampert, M.A., Proc. IRE 50, 1781 (1962).CrossRefGoogle Scholar
7Lampert, M.A., Rep. Prog. Phys. 27, 329 (1964).CrossRefGoogle Scholar
8Barnett, A. M., Ph.D. Thesis, Carnegie Inst. of Tech., Pittsburgh, PA, 1966.Google Scholar
9Barnett, A.M. and Milnes, A.G., J. Appl. Phys. 37, 4215 (1966).Google Scholar
10Barnett, A.M. and Milnes, A.G., IEEE Trans. Elec. Dev. ED-13, 816 (1966).Google Scholar
11Ovshinsky, S. R., Evans, E. J., Nelson, D. L., and Fritzsche, H., IEEE Trans. Nucl. Sci. 51, 311 (1968).Google Scholar
12Adler, D., Shur, M.S., Silver, M., and Ovshinsky, S.R., J. Appl. Phys. 31, 3289 (1980).Google Scholar
13Richardson, J. R., J. Vac. Sci. Technol. 5, 169 (1968).Google Scholar
14Higgins, J. K., Temple, B. K., and Lewis, J. E., J. Non-Cryst. Solids 23, 187 (1977).Google Scholar
15Gelder, D. and Guy, A. G., in Moving Boundary Problems in HeatFlow and Diffusion, edited by Ockendon, J. R. and Hodgkins, W. R. (Clarendon Press, Oxford, UK, 1975).Google Scholar
16Berglund, C., IEEE Trans. Elec. Dev. ED-16, 432 (1969).Google Scholar
17The I-V characteristic shown in Fig. 2 is for a device with geometry shown in Fig. 1. A diamond scribe was used to scratch two thin lines across the film, perpendicular to the VO2+x channel. These lines (not shown in the figure) interrupted any small electrical current flowing in parallel with the channel. These scratches in the film did not affect significantly the I-V characteristic of the device, indicating that most (if not all) device current flows in the VO2+X channel.Google Scholar
18Ridley, B.K., Proc. Phys. Soc. London 82, 954 (1963).CrossRefGoogle Scholar
19Steensel, K. van, Burg, F. van de, and Kooy, C., Philips Res. Rep. 22, 170 (1967).Google Scholar
20Handbook of Chem. & Phys., edited by Weast, R.C. et al. (CRC Press, Inc., 1987).Google Scholar
21Duchene, J., Terraillon, M., Pailly, P., and Adam, G., Appl. Phys. Lett. 19, 115 (1971).CrossRefGoogle Scholar