Hostname: page-component-84b7d79bbc-fnpn6 Total loading time: 0 Render date: 2024-07-30T09:26:19.036Z Has data issue: false hasContentIssue false
  • English
  • Français

Formation of a ternary silicide for Ni/Ti/Si (100) and Ni/TiSi2 structures

Published online by Cambridge University Press:  31 January 2011

M. Setton ,
J. Van der Spiegel  and
B. Rothman
M. Setton
Affiliation:
Laboratory for Research on the Structure of Matter, Department of Materials Science and Engineering, The University of Pennsylvania, Philadelphia, Pennsylvania 19104
J. Van der Spiegel
Affiliation:
Laboratory for Research on the Structure of Matter, Department of Materials Science and Engineering, The University of Pennsylvania, Philadelphia, Pennsylvania 19104
B. Rothman
Affiliation:
Laboratory for Research on the Structure of Matter, Department of Materials Science and Engineering, The University of Pennsylvania, Philadelphia, Pennsylvania 19104
Get access

Abstract

Phase formation was studied for Ni/Ti/Si and Ni/TiSi2 structures processed by vacuum RTP. Intermetallic compounds Ni3Ti and Ti2Ni form sequentially above 425 °C for metal bilayers Ni/Ti on Si, as Ni diffuses into Ti. When the temperature reaches 550 °C, Si becomes mobile and diffuses into the Ni–Ti compound, resulting in the growth of a ternary phase Ti4Ni4Si7, (V phase). If Ni is in excess with respect to this ternary silicide, a separate layer of Ni silicide grows between the substrate and the V phase, due to the fact that Ni is the main diffusing species. For the case of an excess Ti, the Si atoms are the most mobile species during Ti silicidation. Below 700 °C, TiSi2 grows with a C 49 structure whereas a mixture of TiSi2 C 54 and V phase forms at high temperature, without phase separation in distinct layers. Ni is also a fast diffuser in TiSi2. The activation energy for the diffusion along the grain boundaries of the Ti silicide is about 1.25 ± 0.2 eV. For these Ni/TiSi2 samples too, the same V phase starts to grow at the metal/silicide interface.

Type
Articles
Information
Journal of Materials Research , Volume 4 , Issue 5 , October 1989 , pp. 1218 - 1226
Copyright
Copyright © Materials Research Society 1989

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1Thompson, R.D., Tu, K.N., and Ottaviani, G., J. Appl. Phys. 58 (2), 705 (1985).CrossRefGoogle Scholar
2McGinn, J.T., Hoffman, D.M., Thomas, H. III, and Tarns, F.J. III, Mat. Res. Soc. Symp. Proc. 83, 231 (1987).CrossRefGoogle Scholar
3Setton, M. and Spiegel, J. Van der, Thin Solid Films 156, 351 (1988).CrossRefGoogle Scholar
4Westbrook, J. H., Cerbo, R. K. di, and Peat, A. J., G.E. Tech. Report 58-RL-2117 (1958).Google Scholar
5Markiv, V. Y., Gladyshevskii, E. I., Rripyakevich, P. I., and Fedoruk, T. I., Izvestiya Akad. Nauk. SSSR, Neorg. Mater. 2, No. 7, 1317 (1966).Google Scholar
6Jeitschko, W., Jordan, A.G., and Beck, P. A., The Met. Soc. Trans., AIME 245, 335 (1969).Google Scholar
7Bisi, O., Calandra, C., Pennino, U. del, Sassaroli, P., and Valeri, S., Phys. Rev. B 30 (10), 5696 (1984).CrossRefGoogle Scholar
8Meng, W. J., Fultz, B., Ma, E., and Johnson, W. L., Appl. Phys. Lett. 51 (9), 661 (1987).CrossRefGoogle Scholar
9Hansen, M., Constitution ofBinary Alloys (McGraw-Hill, 1958), p. 1050.Google Scholar
10Pretorius, R., Mat. Res. Soc. Symp. Proc. 25, 15 (1984).Google Scholar
11d'Heurle, F.M. and Gas, P., J. Mater. Res. 1 (1), 205 (1986).CrossRefGoogle Scholar
12Setton, M. and Spiegel, J. Van der (to be published).Google Scholar
13Bardos, D. I., Malik, R. K., Spiegel, F. X., and Beck, P. A., Trans. AIME 236, 40 (1966).Google Scholar
14Köster, U., Ho, P.S., and Lewis, J.E., J. Appl. Phys. 53 (11), 7445 (1982).CrossRefGoogle Scholar
15Gurp, G.J. Van, Daams, J.L. C., Ostroom, A. von, Augustus, L. J. M., and Tamminga, Y., J. Appl. Phys. 50 (11), 6915 (1979).CrossRefGoogle Scholar
16Ting, C. Y. and Wittmer, M., J. Appl. Phys. 54 (2), 937 (1983).CrossRefGoogle Scholar