Hostname: page-component-7bb8b95d7b-pwrkn Total loading time: 0 Render date: 2024-09-12T06:24:09.605Z Has data issue: false hasContentIssue false
  • English
  • Français

Instrumentation of a conventional hardness tester for load-displacement measurement during indentation

Published online by Cambridge University Press:  31 January 2011

G. M. Pharr  and
R. F. Cook
G. M. Pharr
Affiliation:
Department of Materials Science, Rice University, P.O. Box 1892, Houston, Texas 77251
R. F. Cook
Affiliation:
IBM Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598
Get access

Abstract

A conventional microhardness tester has been instrumented with a piezoelectric load cell and capacitance displacement gages to measure load and displacement during indentation. As in other recently-developed load and displacing sensing indentation instruments, the new device can be used to measure a variety of mechanical properties, but has the advantage of being relatively inexpensive to assemble since many of its components are standard equipment. Tests were performed on soda-lime glass and an aluminum alloy, demonstrating the diversity of material elastic-plastic responses under indentation, particularly in the unloading cycle. The data suggest that models of elastic unloading based on invariant indenter-surface contact area may not be general, and may lead to underestimates of hardness and modulus.

Type
Articles
Information
Journal of Materials Research , Volume 5 , Issue 4 , April 1990 , pp. 847 - 851
Copyright
Copyright © Materials Research Society 1990

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1Pethica, J. B., Hutchings, R., and Oliver, W. C., Philos. Mag. A 48, 593 (1983).CrossRefGoogle Scholar
2Oliver, W. C., Hutchings, R., and Pethica, J. B., in ASTM STP 889, edited by Blau, P. J. and Lawn, B. R. (American Society for Testing and Materials, Philadelphia, PA, 1986), pp. 90–108.Google Scholar
3Newey, D., Wilkens, M. A., and Pollock, H. M., J. Phys. E: Sci. Instrum. 15, 119 (1982).CrossRefGoogle Scholar
4Stone, D., LaFontaine, W. R., Alexopoulos, P., Wu, T-W., and Li, Che-Yu, Journal of Materials Research 3 (1), 141 (1988).Google Scholar
5Doerner, M. F. and Nix, W. D., Journal of Materials Research 1, 601 (1986).Google Scholar
6Loubet, J., Georges, J. M., Marchesini, O., and Meille, G., Tribology, J.Journal of Materials Research 106, 43 (1984).Google Scholar
7Shorshorov, M. Kh.,Bulychev, S. I., and Alekhin, V. P., Sov. Phys. Dokl. 26, 769 (1982).Google Scholar
8Gane, N. and Cox, J.M., Philos. Mag. 22, 881 (1970).Google Scholar
9Lawn, B. R. and Howes, V. R., J. Mater. Sci. 6, 2745 (1981).CrossRefGoogle Scholar
10Lawn, B. R., Evans, A. G., and Marshall, D. B., J. Am. Ceram. Soc. 63, 574 (1980).CrossRefGoogle Scholar
11Sneddon, I. N., Int. J. Engrng. Sci. 3, 47 (1965).CrossRefGoogle Scholar
12Pharr, G. M. and Oliver, W. C., Journal of Materials Research 4 (1), 94 (1989).CrossRefGoogle Scholar
13Pharr, G. M., Oliver, W. C., and Clarke, D. R., submitted to J. Electronic Materials.Google Scholar
14Bhattacharya, A. K. and Nix, W. D., Int. J. Solids Structures 24, 881 (1988)CrossRefGoogle Scholar