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Interfacial reactions and adhesion strength of metal/ceramic composites

Published online by Cambridge University Press:  03 March 2011

Hsin-Fu Wang ,
William W. Gerberich  and
Jim E. Angelo
Hsin-Fu Wang
Affiliation:
Department of Materials Science and Engineering, University of Florida, Gainesville, Florida 32611
William W. Gerberich
Affiliation:
Department of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, Minnesota 55455
Jim E. Angelo
Affiliation:
Sandia National Laboratories, Livermore, California 94550
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Abstract

The interfacial fracture energy of Ti/Al2O3 composites was measured with and without a diffusion barrier at different bonding temperatures by using four-point bending tests. It was found that the interfacial fracture energy increases with increasing bonding temperature up to 950 °C. When the bonding temperature was further raised to 1000 °C, the interfacial fracture energy drops. The decrease of the interfacial fracture energy is due to the formation of the continuous intermetallic compound, Ti3Al, at the interface between Ti and Al2O3. By using a diffusion barrier, the interfacial fracture energy decreases from 25.4 to near O J/m2 and 32.9 to 8.7 J/m2 for applied bonding temperatures of 800 and 900 °C, respectively. This is because the diffusion barrier reduced the diffusion of Al across the interface and into the Ti, thereby preventing a strong chemical bond at the interface. For the composite bonded at 900 °C, the crack propagation was found to occur at the interface between the Ti and Al2O3. The interfacial failure was found to be in the Ti3Al reaction layer for the composite processed at 1000 °C. With a diffusion barrier, the crack propagation path follows several interfaces. Evaluation of the processing temperature on the mechanical properties of the Ti was also obtained by using a nanoindentation technique.

Type
Articles
Information
Journal of Materials Research , Volume 10 , Issue 9 , September 1995 , pp. 2367 - 2373
Copyright
Copyright © Materials Research Society 1995

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