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Interfacial reactions and joint strength of Sn–37Pb and Sn–3.5Ag solders with immersion Ag-plated Cu substrate during aging at 150 °C

Published online by Cambridge University Press:  03 March 2011

Jeong-Won Yoon ,
Jun Hyung Lim ,
Hoo-Jeong Lee ,
Jinho Joo ,
Seung-Boo Jung  and
Won-Chul Moon
Jeong-Won Yoon
Affiliation:
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Jangan-gu, Suwon, Gyeonggi-do 440-746, Korea
Jun Hyung Lim
Affiliation:
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Jangan-gu, Suwon, Gyeonggi-do 440-746, Korea
Hoo-Jeong Lee
Affiliation:
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Jangan-gu, Suwon, Gyeonggi-do 440-746, Korea
Jinho Joo
Affiliation:
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Jangan-gu, Suwon, Gyeonggi-do 440-746, Korea
Seung-Boo Jung*
Affiliation:
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Jangan-gu, Suwon, Gyeonggi-do 440-746, Korea
Won-Chul Moon
Affiliation:
Micro Electronic Packaging Consortium, Sungkyunkwan University, Jangan-gu, Suwon, Gyeonggi-do 440-746, Korea
*
a) Address all correspondence to this author. e-mail: sbjung@skku.ac.kr
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Abstract

Joint reliability of immersion Ag with two different solders, Sn–37Pb and Sn–3.5Ag, were evaluated. We first compared the interfacial reactions of the two solder joints and also successfully revealed a connection between the interfacial reaction behavior and mechanical reliability. The Sn–Pb solder produced a Pb-rich phase along the interface between the solder and the Cu substrate during aging. In contrast, the Sn–Ag solder exhibits an off-eutectic reaction to produce the eutectic phase and Ag3Sn precipitate. The shear test results show that the Sn–Pb solder joint fractured along the interface showing brittle failure indications possibly due to the brittle Pb-rich layer. In contrast, the failure of Sn–Ag solder joint was only through the bulk solder, providing evidence that the interface is mechanically reliable. The results from this study confirm that the immersion Ag/Sn–Ag solder joint is mechanically robust, and thus the combination is a viable option for a Pb-free package system.

Keywords

Electronic materialPackagingSoldering
Type
Articles
Information
Journal of Materials Research , Volume 21 , Issue 12 , December 2006 , pp. 3196 - 3204
Copyright
Copyright © Materials Research Society 2006

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References

REFERENCES

1.Arra, M., Shangguan, D., Xie, D., Sundelin, J., Lepisto, T., Ristolainen, E.: Study of immersion silver and tin printed-circuit-board surface finishes in lead-free solder applications. J. Electron. Mater. 33, 977 (2004).Google Scholar
2.Zeng, K., Tu, K.N.: Six cases of reliability study of Pb-free solder joints in electronic packaging technology. Mater. Sci. Eng. R. R38, 55 (2002).Google Scholar
3.Yoon, J.W., Lee, C.B., Jung, S.B.: Growth of an intermetallic compound layer with Sn–3.5Ag-5Bi on Cu and Ni–P/Cu during aging treatment. J. Electron. Mater. 32, 1195 (2003).Google Scholar
4.Abtew, M., Selvaduray, G.: Lead-free solders in microelectronics. Mater. Sci. Eng. R. R27, 95 (2000).Google Scholar
5.Yoon, J.W., Kim, S.W., Jung, S.B.: IMC growth and shear strength of Sn–Ag–Bi–In/Au/Ni/Cu BGA joints during aging. Mater. Trans. 45, 727 (2004).Google Scholar
6.Li, M., Zhang, F., Chen, W.T., Zeng, K., Tu, K.N., Balkan, H., Elenius, P.: Interfacial microstructure evolution between eutectic SnAgCu solder and Al/Ni(V)/Cu thin films. J. Mater. Res. 17, 1612 (2002).Google Scholar
7.Yoon, J.W., Kim, S.W., Koo, J.M., Kim, D.G., Jung, S.B.: Reliability investigation and interfacial reaction of ball-grid-array packages using the lead-free Sn-Cu solder. J. Electron. Mater. 33, 1190 (2004).Google Scholar
8.Islam, M.N., Chan, Y.C.: Interfacial reactions of Sn–Cu solder with Ni/Au surface finish on Cu pad during reflow and aging in ball grid array packages. Mater. Sci. Eng., B 117, 246 (2005).Google Scholar
9.He, M., Chen, Z., Qi, G.: Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization. Acta Mater. 52, 2047 (2004).Google Scholar
10.Chen, W.M., McCloskey, P., O’Mathuna, S.C.: Isothermal aging effects on the microstructure and solder bump shear strength of eutectic Sn37Pb and Sn3.5Ag solders. Microelectron. Reliab. 46, 896 (2006).Google Scholar
11.Ghosh, G.: Dissolution and interfacial reactions of thin-film Ti/Ni/Ag metallizations in solder joints. Acta Mater. 49, 2609 (2001).Google Scholar
12.Jang, J.W., Frear, D.R., Lee, T.Y., Tu, K.N.: Morphology of interfacial reaction between lead-free solders and electroless Ni–P under bump metallization. J. Appl. Phys. 88, 6359 (2000).Google Scholar
13.Alam, M.O., Chan, Y.C., Tu, K.N.: Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn–Ag solder and Au/electroless Ni(P)/Cu bond pad. J. Appl. Phys. 94, 4108 (2003).Google Scholar
14.Vuorinen, V., Laurila, T., Yu, H., Kivilahti, J.K.: Phase formation between lead-free Sn–Ag–Cu solder and Ni(P)/Au finishes. J. Appl. Phys. 99, 023530 (2006).Google Scholar
15.Lee, K.Y., Li, M., Tu, K.N.: Growth and ripening of (Au,Ni)Sn4 phase in Pb-free and Pb-containing solders on Ni/Au metallization. J. Mater. Res. 18, 2562 (2003).Google Scholar
16.Alam, M.O., Chan, Y.C., Tu, K.N.: Elimination of Au-embrittlement in solder joints on Au/Ni metallization. J. Mater. Res. 19, 1303 (2004).Google Scholar
17.Wang, C.H., Chen, S.W.: Sn–0.7wt%Cu/Ni interfacial reactions at 250 °C. Acta Mater. 54, 247 (2006).Google Scholar
18.Yoon, J.W., Lee, C.B., Kim, D.U., Jung, S.B.: Reaction diffusions of Cu6Sn5 and Cu3Sn intermetallic compound in the couple of Sn–3.5Ag eutectic solder and copper substrate. Metall. Mater. Int. 9, 193 (2003).Google Scholar
19.Harris, P.G., Chaggar, K.S.: The role of intermetallic compounds in lead-free soldering. Solder. Surf. Mt. Technol. 10, 38 (1998).CrossRefGoogle Scholar
20.Lee, C.B., Lee, I.Y., Jung, S.B., Shur, C.C.: Effect of surface finishes on ball shear strength in BGA joints with Sn–3.5 mass% Ag solder. Mater. Trans. 43, 751 (2002).Google Scholar
21.Vianco, P.T., Kilgo, A.C., Grant, R.: Intermetallic compound layer growth by solid state reactions between 58Bi–42Sn solder and copper. J. Electron. Mater. 24, 1493 (1995).Google Scholar
22.Lee, T.Y., Choi, W.J., Tu, K.N., Hang, J.W., Kuo, S.M., Lin, J.K., Frear, D.R., Zeng, K., Kivilahti, J.K.: Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu. J. Mater. Res. 17, 291 (2002).Google Scholar