Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Yoon, Jeong-Won
and
Jung, Seung-Boo
2008.
Effect of immersion Ag surface finish on interfacial reaction and mechanical reliability of Sn–3.5Ag–0.7Cu solder joint.
Journal of Alloys and Compounds,
Vol. 458,
Issue. 1-2,
p.
200.
Kang, Han-Byul
Lee, Jae-Wook
Bae, Jee-Hwan
Park, Min-Ho
Yoon, Jeong-Won
Jung, Seung-Boo
Ju, Jae-Seon
and
Yang, Cheol-Woong
2008.
Initial interfacial reaction layers formed in Sn–3.5Ag solder/electroless Ni–P plated Cu substrate system.
Journal of Materials Research,
Vol. 23,
Issue. 8,
p.
2195.
Kang, Han-Byul
Bae, Jee-Hwan
Lee, Jae-Wook
Park, Min-Ho
Yoon, Jeong-Won
Jung, Seung-Boo
and
Yang, Cheol-Woong
2008.
Characterization of Interfacial Reaction Layers Formed Between Sn-3.5Ag Solder and Electroless Ni-Immersion Au-Plated Cu Substrates.
Journal of Electronic Materials,
Vol. 37,
Issue. 1,
p.
84.
Lin, Chi-pu
and
Chen, Chih-ming
2009.
Intermetallic Compound Formation and Evolution in Solid-State Sn/Immersion-Ag/Cu Trilayer Interfacial Reactions on a Flexible Polymer Board.
Journal of Electronic Materials,
Vol. 38,
Issue. 6,
p.
908.
Yoon, Jeong-Won
Noh, Bo-In
Kim, Bong-Kyun
Shur, Chang-Chae
and
Jung, Seung-Boo
2009.
Wettability and interfacial reactions of Sn–Ag–Cu/Cu and Sn–Ag–Ni/Cu solder joints.
Journal of Alloys and Compounds,
Vol. 486,
Issue. 1-2,
p.
142.
Wang, Weiqiang
Choubey, Anupam
Azarian, Michael H.
and
Pecht, Michael
2009.
An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics.
Journal of Electronic Materials,
Vol. 38,
Issue. 6,
p.
815.
Yoon, Jeong-Won
Jin-Kyu Jang
Jung-Hyun Choi
Jong-Gun Lee
Lee, Jong-Bum
Noh, Bo-In
and
Jung, Seung-Boo
2010.
Thermo-compression bonding of electrodes between FPCB and RPCB.
p.
811.
Kang, Han-Byul
Bae, Jee-Hwan
Yoon, Jeong-Won
Jung, Seung-Boo
Park, Jongwoo
and
Yang, Cheol-Woong
2010.
Characterization of ternary Ni2SnP layer in Sn–3.5Ag–0.7Cu/electroless Ni (P) solder joint.
Scripta Materialia,
Vol. 63,
Issue. 11,
p.
1108.
Zhang, QingKe
Zou, HeFei
and
Zhang, Zhe-Feng
2010.
Improving tensile and fatigue properties of Sn–58Bi/Cu solder joints through alloying substrate.
Journal of Materials Research,
Vol. 25,
Issue. 2,
p.
303.
Yoon, Jeong-Won
Noh, Bo-In
and
Jung, Seung-Boo
2010.
Effects of third element and surface finish on interfacial reactions of Sn–Ag–xCu (or Ni)/(Cu or ENIG) solder joints.
Journal of Alloys and Compounds,
Vol. 506,
Issue. 1,
p.
331.
Jee, Y. K.
and
Yu, Jin
2010.
Interfacial Reactions and Joint Strengths of Sn-xZn Solders with Immersion Ag UBM.
Journal of Electronic Materials,
Vol. 39,
Issue. 10,
p.
2286.
Cheng, Cong-qian
Zhao, Jie
and
Xu, Yang
2010.
Kinetics of intermetallic compound layers and Cu dissolution at Sn1.5Cu/Cu interface under high magnetic field.
Journal of Materials Research,
Vol. 25,
Issue. 2,
p.
359.
Chen, Chih-Chi
Chan, Ya-Ting
and
Chen, Yue-Ting
2010.
Interfacial reactions between Sn-Cu solders and Ni-Co alloys at 250 °C.
Journal of Materials Research,
Vol. 25,
Issue. 7,
p.
1321.
Yoon, Jeong-Won
Noh, Bo-In
Choi, Jung-Hyun
and
Jung, Seung-Boo
2011.
Effect of adding Ce on interfacial reactions between Sn–Ag solder and Cu.
Journal of Materials Science: Materials in Electronics,
Vol. 22,
Issue. 7,
p.
745.
Kang, Han-Byul
Bae, Jee-Hwan
Yoon, Jeong-Won
Jung, Seung-Boo
Park, Jongwoo
and
Yang, Cheol-Woong
2011.
In situ TEM characterization of interfacial reaction in Sn–3.5Ag/electroless Ni(P) solder joint.
Scripta Materialia,
Vol. 64,
Issue. 7,
p.
597.
Yoon, Jeong-Won
Noh, Bo-In
and
Jung, Seung-Boo
2011.
Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint.
Journal of Electronic Materials,
Vol. 40,
Issue. 9,
p.
1950.
Yoon, Jeong-Won
Lee, Jong-Gun
Lee, Jong-Bum
Noh, Bo-In
and
Jung, Seung-Boo
2012.
Thermo-compression bonding of electrodes between FPCB and RPCB by using Pb-free solders.
Journal of Materials Science: Materials in Electronics,
Vol. 23,
Issue. 1,
p.
41.
Yang, Ming
Li, Mingyu
and
Kim, Jongmyung
2012.
Texture evolution and its effects on growth of intermetallic compounds formed at eutectic Sn37Pb/Cu interface during solid-state aging.
Intermetallics,
Vol. 31,
Issue. ,
p.
177.
Yang, Ming
Li, Mingyu
and
Ma, Xin
2013.
Epitaxial growth of intermetallic compounds formed at eutectic Sn37Pb/polycrystalline Cu interface during solid-state aging.
p.
830.
Yoon, Jeong-Won
Ko, Min-Kwan
Noh, Bo-In
and
Jung, Seung-Boo
2013.
Joint reliability evaluation of thermo-compression bonded FPCB/RPCB joints under high temperature storage test.
Microelectronics Reliability,
Vol. 53,
Issue. 12,
p.
2036.