Hostname: page-component-5c6d5d7d68-wbk2r Total loading time: 0 Render date: 2024-08-17T19:16:58.487Z Has data issue: false hasContentIssue false
  • English
  • Français

Interfacial reactions of lead-free Sn–Zn based solders on Cu and Cu plated electroless Ni–P/Au layer under aging at 150 °C

Published online by Cambridge University Press:  01 December 2004

Chia-Wei Huang  and
Kwang-Lung Lin
Chia-Wei Huang*
Affiliation:
Department of Materials Science and Engineering, National Cheng Kung University,Tainan 701, Taiwan, Republic of China
Kwang-Lung Lin
Affiliation:
Department of Materials Science and Engineering, National Cheng Kung University,Tainan 701, Taiwan, Republic of China
*
a)Address all correspondence to this author.e-mail: matkllin@mail.ncku.edu.tw
Get access

Abstract

The interfacial reactions of Sn–Zn based solder on Cu and Cu/Ni–P/Cu–plating substrates under aging at 150 °C were investigated in this study. The compositions of solders investigated were Sn–9Zn, Sn–8.55Zn–0.45Al, and Sn–8.55Zn–0.45Al–0.5Ag solders in weight percent. The experimental results indicated that the Cu substrate formed Cu5Zn8 with the Sn–9Zn solder and Al–Cu–Zn compound with Al–containing solders. However, it was detected that Cu6Sn5 formed at the Sn–9Zn/Cu interface and Cu5Zn8 formed at the Al–containing solders/Cu interface after aging for 1000 h. When it contacted with the Cu/Ni–P/Au substrate, the Sn–9Zn solder formed Au–Zn compound, and the Al–containing solders formed Al–Cu–Zn compound at the interface. After a long aging time, the intermetallic compounds existing between solders and the Cu/Ni–P/Au metallization layers almost did not grow. It was found that the interdiffusion between solders and Cu/Ni–P/Au was slower than that with Cu under aging. Furthermore, the addition of Ag to Sn–Zn solder resulted in the formation of AgZn3 particles at the interface.

Keywords

AgingIntermetallic alloysPackaging
Type
Articles
Information
Journal of Materials Research , Volume 19 , Issue 12 , December 2004 , pp. 3560 - 3568
Copyright
Copyright © Materials Research Society 2004

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1Jin, S.: Developing lead-free solders: A challenge and opportunity. JOM 45, 13 (1993).CrossRefGoogle Scholar
2Abtew, M. and Selvaduray, G.: Lead-free solders in microelectronics. Mater. Sci. Eng. R 27, 95 (2000).CrossRefGoogle Scholar
3Massalski, T.B.: Binary Alloy Phase Diagrams, 2nd ed. (ASM, New York, NY, 1987), pp. 1848, 2086Google Scholar
4Sebaoun, A., Vincent, D. and Treheus, D.: Al–Zn–Sn phase diagram-isothermal diffusion in ternary system. Mater. Sci. Technol. 3, 241 (1987).CrossRefGoogle Scholar
5Lin, K.L. and Liu, T.P.: High temperature oxidation of a Sn–Zn–Al solder. Oxid. Met. 50, 255 (1998).CrossRefGoogle Scholar
6Takemoto, T. and Funaki, T.: Role of electrode difference between lead-free solder and copper base metal in wetting. Mater. Trans. JIM 43, 1784 (2002).Google Scholar
7Zeng, K. and Tu, K.N.: Six cases of reliability study of Pb-free solder joints in electronic packaging technology. Mater. Sci. Eng. R 38, 55 (2002).CrossRefGoogle Scholar
8Nishiura, M., Nakayama, A., Sakatani, S., Kohara, Y., Uenishi, K. and Kobayashi, K.F.: Mechanical strength and microstructure of BGA joints using lead-free solders. Mater. Trans. JIM 43, 1802 (2002).Google Scholar
9Lee, C.B., Jung, S.B., Shin, Y.E. and Shur, C.C.: Effect of isothermal aging on ball shear strength in BGA joints with Sn– 3.5Ag–0.75Cu solder. Mater. Trans. JIM 43, 1858 (2002).CrossRefGoogle Scholar
10Tu, K.N. and Zeng, K.: Tin-lead (SnPb) solder reaction in flip chip technology. Mater. Sci. Eng. R 34, 1 (2001).CrossRefGoogle Scholar
11Suganuma, K.: Heat resistance of Sn–9Zn solder/Cu interface with or without coating. J. Mater. Res. 15, 884 (2000).CrossRefGoogle Scholar
12Lin, K.L. and Huang, C.W.: Effect of thiourea and lead acetate on the deposition of electroless nickel. Mater. Chem. Phys. 76, 204 (2002).Google Scholar
13Lin, K.L. and Hsu, H.M.: Sn–Zn–Al Pb-free solder—An inherent barrier solder for Cu content. J. Electron. Mater. 30, 1068 (2001).CrossRefGoogle Scholar
14Huang, C.W. and Lin, K.L.: Wetting properties of and interfacial reactions in lead-free Sn–Zn based solders on Cu and Cu plated with an electroless Ni-P/Au layer. Mater. Trans. JIM 45, 1 (2004).CrossRefGoogle Scholar
15Lee, H.M., Yoon, S.W. and Lee, B.J.: Thermodynamic prediction of interface phases at Cu/solder joints. J. Electron. Mater. 27, 1161 (1998).CrossRefGoogle Scholar
16Hultgren, R.: Selected Values of Thermodynamic Properties of Metals and Alloys (Wiley, New York, NY, 1963), p. 712Google Scholar
17Huang, C.W. and Lin, K.L.: Microstructures and mechanical properties of Sn–8.55Zn–0.45Al–XAg solders. J. Mater. Res. 18, 1528 (2003).CrossRefGoogle Scholar
18Song, J.M. and Lin, K.L.: Behavior of intermetallics in liquid Sn– Zn–Ag solder alloys. J. Mater. Res. 18, 2060 (2003).CrossRefGoogle Scholar
19McCormack, M., Jin, S., Kammlott, G.W. and Chen, H.S.: New Pb-free solder alloy with superior mechanical properties. Appl. Phys. Lett. 63, 15 (1993).CrossRefGoogle Scholar
20McCormack, M. and Jin, S.: Improved mechanical properties in new, Pb-free solder alloys. J. Electron. Mater. 23, 715 (1994).CrossRefGoogle Scholar
21McCormack, M., Kammlott, G.W., Chen, H.S. and Jin, S.: New lead-free, Sn–Ag–Zn–Cu solder alloy with improved mechanical properties. Appl. Phys. Lett. 65, 1233 (1994).CrossRefGoogle Scholar
22Chonan, Y., Komiyama, T., Onuki, J., Urao, R., Kimura, T. and Nagano, T.: Influence of P content in electroless plated Ni-P alloy film on interfacial structures and strength between Sn–Zn solder and plated Au/Ni–P alloy film. Mater. Trans. JIM 43, 1887 (2002).CrossRefGoogle Scholar