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Reduction of copper oxide with graphite by mechanical alloying

Published online by Cambridge University Press:  31 January 2011

L. Liu
Affiliation:
The State Key Lab of Plastic Forming Stimulation and Die & Mould Technology, Department of Materials Science and Engineering, Huazhong University of Science & Technology, 430074 Wuhan, People's Republic of China
T. J. Zhang
Affiliation:
The State Key Lab of Plastic Forming Stimulation and Die & Mould Technology, Department of Materials Science and Engineering, Huazhong University of Science & Technology, 430074 Wuhan, People's Republic of China
K. Cui
Affiliation:
The State Key Lab of Plastic Forming Stimulation and Die & Mould Technology, Department of Materials Science and Engineering, Huazhong University of Science & Technology, 430074 Wuhan, People's Republic of China
Y. D. Dong
Affiliation:
Institute of Materials, Shanghai University, Yanchang Road 149, Shanghai 200072, People's Republic of China
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Abstract

The reduction of CuO with different amounts of C (CuO:C = 2:1, 2:1.5, and 2:2 molar ratios) driven by mechanical alloying was examined by x-ray diffraction and transmission electron microscopy. It was found that reduction behaviors are closely related to the carbon content. The reduction of CuO for the mixture with 1 mol of carbon follows a two-step process; i.e., CuO → Cu → Cu2O. However, the CuO can be completely converted to Cu for the mixtures with higher carbon content. A tentative model in terms of solid-state reactions at the interfaces is proposed to explain the effect of carbon content. Additionally, the thermal responses of the premilled mixtures were investigated by thermogravity and differential thermal analysis followed by x-ray identification. Contrary to mechanical alloying, reduction of CuO during thermal treatment follows a transition sequence of CuO → Cu2O → Cu. The preferential formation of Cu2O at the early annealing stage is probably due to the involvement of gaseous reduction.

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Articles
Copyright
Copyright © Materials Research Society 1999

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