Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Leung, O. S.
and
Nix, W. D.
1999.
Wafer Curvature Studies of Strengthening Mechanisms in Thin Films on Substrates.
MRS Proceedings,
Vol. 594,
Issue. ,
Gouldstone, A.
Wikström, A.
Gudmundson, P.
and
Suresh, S.
1999.
Onset of plastic yielding in thin metal lines deposited on substrates.
Scripta Materialia,
Vol. 41,
Issue. 3,
p.
297.
Park, T.-S
and
Suresh, S
2000.
Effects of line and passivation geometry on curvature evolution during processing and thermal cycling in copper interconnect lines.
Acta Materialia,
Vol. 48,
Issue. 12,
p.
3169.
Hutchinson, John W.
2000.
Plasticity at the micron scale.
International Journal of Solids and Structures,
Vol. 37,
Issue. 1-2,
p.
225.
Nix, W.D.
and
Leung, O.S.
2001.
Encyclopedia of Materials: Science and Technology.
p.
9262.
Hommel, M.
and
Kraft, O.
2001.
Deformation behavior of thin copper films on deformable substrates.
Acta Materialia,
Vol. 49,
Issue. 19,
p.
3935.
Shu, J.Y.
Fleck, N.A.
Van der Giessen, E.
and
Needleman, A.
2001.
Boundary layers in constrained plastic flow: comparison of nonlocal and discrete dislocation plasticity.
Journal of the Mechanics and Physics of Solids,
Vol. 49,
Issue. 6,
p.
1361.
Weiss, D.
Gao, H.
and
Arzt, E.
2001.
Constrained diffusional creep in UHV-produced copper thin films.
Acta Materialia,
Vol. 49,
Issue. 13,
p.
2395.
Bassani, J.L.
2001.
Incompatibility and a simple gradient theory of plasticity.
Journal of the Mechanics and Physics of Solids,
Vol. 49,
Issue. 9,
p.
1983.
Wang, P.-C.
and
Filippi, R. G.
2001.
Electromigration threshold in copper interconnects.
Applied Physics Letters,
Vol. 78,
Issue. 23,
p.
3598.
Shen, Y.-L.
and
Ramamurty, U.
2001.
Constitutive Response of Passivated Copper Films: Experiments and Analyses.
MRS Proceedings,
Vol. 695,
Issue. ,
Choi, Yoonjoon
and
Suresh, Subra
2002.
Size effects on the mechanical properties of thin polycrystalline metal films on substrates.
Acta Materialia,
Vol. 50,
Issue. 7,
p.
1881.
Gudmundson, P.
and
Wikström, A.
2002.
Stresses in thin films and interconnect lines.
Microelectronic Engineering,
Vol. 60,
Issue. 1-2,
p.
17.
Wikström, A.
and
Nygårds, M.
2002.
Anisotropy and texture in thin copper films—an elasto-plastic analysis.
Acta Materialia,
Vol. 50,
Issue. 4,
p.
857.
Kraft, O.
Freund, L. B.
Phillips, R.
and
Arzt, E.
2002.
Dislocation Plasticity in Thin Metal Films.
MRS Bulletin,
Vol. 27,
Issue. 1,
p.
30.
Legros, M.
Hemker, K.J.
Gouldstone, A.
Suresh, S.
Keller-Flaig, R.-M.
and
Arzt, E.
2002.
Microstructural evolution in passivated Al films on Si substrates during thermal cycling.
Acta Materialia,
Vol. 50,
Issue. 13,
p.
3435.
Puigcorbé, J
Vilà, A
and
Morante, J.R
2003.
Thermal fatigue modeling of micromachined gas sensors.
Sensors and Actuators B: Chemical,
Vol. 95,
Issue. 1-3,
p.
275.
SUO, Z.
2003.
Comprehensive Structural Integrity.
p.
303.
Baker, S.P.
Keller-Flaig, R.-M.
and
Shu, J.B.
2003.
Bauschinger effect and anomalous thermomechanical deformation induced by oxygen in passivated thin Cu films on substrates.
Acta Materialia,
Vol. 51,
Issue. 10,
p.
3019.
Shu, Jonathan B.
Clyburn, Susan B.
Mates, Thomas E.
and
Baker, Shefford P.
2003.
Effect of oxygen on the thermomechanical behavior of passivated Cu thin films.
Journal of Materials Research,
Vol. 18,
Issue. 9,
p.
2122.