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Stress-driven surface evolution in heteroepitaxial thin films: Anisotropy of the two-dimensional roughening mode

Published online by Cambridge University Press:  31 January 2011

Cengiz S. Ozkan ,
William D. Nix  and
Huajian Gao
Cengiz S. Ozkan
Affiliation:
Process Development Group, Applied Micro Circuits Corporation, San Diego, California 92121
William D. Nix
Affiliation:
Materials Science and Engineering Department, Stanford University, Stanford, California 94305
Huajian Gao
Affiliation:
Mechanical Engineering Department, Stanford University, Stanford, California 94305
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Abstract

We have analyzed the anisotropic behavior of surface roughening in Si1−xGex/Si(001) heterostructures by use of methods of elastic analysis of undulated surfaces and perturbation analysis on the basis of global energy variations associated with surface evolution. Both methods have shown that the two-dimensional stage of surface roughening preferentially takes place in the form of ridges aligned along the two orthogonal 〈100〉 type directions. This prediction has been confirmed by ex situ experimental observations of surface evolution by use of atomic force microscopy and transmission electron microscopy in both subcritically and supercritically thick Si1−xGex films grown on Si(001) substrates. Further experiments in supercritically thick films have revealed a remarkable interplay between defect formation and surface evolution: the formation of a network of 〈110〉?misfit dislocations in the latter stages alters the evolution process by rotating the ridge formations toward the 〈110〉 type directions.

Type
Articles
Information
Journal of Materials Research , Volume 14 , Issue 8 , August 1999 , pp. 3247 - 3256
Copyright
Copyright © Materials Research Society 1999

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