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A study of barium strontium titanate thin films for use in bypass capacitors

Published online by Cambridge University Press:  31 January 2011

B. A. Baumert
Affiliation:
Materials Technology Center, Materials Research and Strategic Technologies, Motorola Semiconductor Products Sector, 2200 West Broadway Road, Mail Drop M360, Mesa, Arizona 85202
L-H. Chang
Affiliation:
Materials Technology Center, Materials Research and Strategic Technologies, Motorola Semiconductor Products Sector, 2200 West Broadway Road, Mail Drop M360, Mesa, Arizona 85202
A. T. Matsuda
Affiliation:
Materials Technology Center, Materials Research and Strategic Technologies, Motorola Semiconductor Products Sector, 2200 West Broadway Road, Mail Drop M360, Mesa, Arizona 85202
C. J. Tracy
Affiliation:
Materials Technology Center, Materials Research and Strategic Technologies, Motorola Semiconductor Products Sector, 2200 West Broadway Road, Mail Drop M360, Mesa, Arizona 85202
N. G. Cave
Affiliation:
Materials Characterization Laboratory, Materials Research and Strategic Technologies, Motorola Semiconductor Products Sector, 2200 West Broadway Road, Mail Drop M360, Mesa, Arizona 85202
R. B. Gregory
Affiliation:
Materials Characterization Laboratory, Materials Research and Strategic Technologies, Motorola Semiconductor Products Sector, 2200 West Broadway Road, Mail Drop M360, Mesa, Arizona 85202
P. L. Fejes
Affiliation:
Materials Characterization Laboratory, Materials Research and Strategic Technologies, Motorola Semiconductor Products Sector, 2200 West Broadway Road, Mail Drop M360, Mesa, Arizona 85202
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Physical and electrical characterization techniques have been applied to the problem of developing a lower temperature process for spin-on Ba0.7Sr0.3TiO3 thin films and capacitors compatible with on-chip aluminum metallization. The films were prepared by spin-coating from carboxylate precursors and were processed at temperatures between 650 °C and 450 °C. Capacitors annealed at higher temperatures have a dielectric constant (κ) of 382, a C/A of 20 fF/μm2, and a leakage current density of 2 × 10−7 A/cm2 at 3.3 V. Those processed at 450 °C show occasionally promising but inconsistent results, correlated using TEM images with locally variable crystallization into the perovskite phase. The kinetics of the spin-on solution chemical decomposition and crystallization has been investigated through the use of x-ray diffraction (XRD), thermogravimetric analysis (TGA), and Raman spectroscopy.

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Articles
Copyright
Copyright © Materials Research Society 1998

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References

1.Arita, K., Fujii, E., Shimada, Y., Uemoto, Y., Nasu, T., Inoue, A., Matsuda, A., Otsuki, T., and Suzuoka, N., Jpn. J. Appl. Phys. 33, 53975399 (1994).CrossRefGoogle Scholar
2.Chivukula, V., Ilowski, J., Emesh, I., McDonald, D., and Leung, P., Integrated Ferroelectrics 10, 247255 (1995).CrossRefGoogle Scholar
3.Hsu, W. Y., Luttmer, J. D., Tsu, R., Summerfelt, S., Bedekar, M., Tokumoto, T., and Nulman, J., Appl. Phys. Lett. 66, 29752977 (1995).CrossRefGoogle Scholar
4.Kawahara, T., Yamamuka, M., Yuuki, A., and Ono, K., Jpn. J. Appl. Phys. 34, 50775082 (1995).CrossRefGoogle Scholar
5.Takemura, K., Yamamichi, S., Lesaicherre, P-Y., Tokashiki, K., Miyamoto, H., Ono, H., Miyasaka, Y., and Yoshida, M., Jpn. J. Appl. Phys. 34, 52245229 (1995).CrossRefGoogle Scholar
6.Jia, Q. X., Wu, X. D., Foltyn, S. R., and Tiwari, P., Appl. Phys. Lett. 66, 21972199 (1995).CrossRefGoogle Scholar
7.Numata, K., Fukuda, Y., Aoki, K., and Nishimura, A., Jpn. J. Appl. Phys. 34, 52455249 (1995).CrossRefGoogle Scholar
8.Hwang, C. S., Park, S. O., Kang, C. S., Cho, H-J., Kang, H-K., Ahn, S. T., and Lee, M. Y., Jpn. J. Appl. Phys. 34, 51785183 (1995).CrossRefGoogle Scholar
9.Nakamura, T., Yamanaka, Y., Morimoto, A., and Shimizu, T., Jpn. J. Appl. Phys. 34, 51505153 (1995).CrossRefGoogle Scholar
10.Abe, K. and Komatsu, S., Jpn. J. Appl. Phys. 33, 52975300 (1994).Google Scholar
11.Kirlin, P., Bilodeau, S., and van Buskirk, P., Integrated Ferroelectrics 7, 307318 (1995).CrossRefGoogle Scholar
12.Syamaprasad, U., Galgali, R. K., and Mohanty, B. C., Mater. Lett. 7, 197200 (1988).CrossRefGoogle Scholar
13.Nowotny, J. and Rekas, M., in Key Engineering Materials (Trans Tech Publications, Switzerland, 1992), pp. 45144.Google Scholar
14.Solymar, L. and Walsh, D., Lectures on the Electrical Properties of Materials (Oxford Science Publications, Oxford, 1988).Google Scholar
15.Kondo, I., Yoneyama, T., Takenaka, O., and Kinbara, A., J. Vac. Sci. Technol. A 10, 34563459 (1992).CrossRefGoogle Scholar
16.Sreenivas, K., Reaney, I., Maeder, T., Setter, N., Jagadish, C., and Elliman, R. G., J. Appl. Phys. 75, 232239 (1994).CrossRefGoogle Scholar
17.Olowolafe, J., Jones, R. E. Jr., Campbell, A. C., Hegde, R. I., Mogab, C. J., and Gregory, R. B., J. Appl. Phys. 73, 17641772 (1993).CrossRefGoogle Scholar
18.Fox, G. R., Trolier-McKinstry, S., Krupanidhi, S. B., and Casas, L. M., J. Mater. Res. 10, 15081515 (1995).CrossRefGoogle Scholar
19.Al-Shareef, H. N. and Kingon, A. I., in Ferroelectric Thin Films: Synthesis and Basic Properties (Gordon and Breach, New York, 1995).Google Scholar
20.Tsu, R., Liu, H-Y., Hsu, W-Y., Summerfelt, S., Aoki, K., and Gnade, B., in Ferroelectric Thin Films IV, edited by Tuttle, B. A., Desu, S. B., Ramesh, R., and Shiosaki, T. (Mater. Res. Soc. Symp. Proc. 361, Pittsburgh, PA, 1995), pp. 275280.Google Scholar
21.Nazeri, A., Kahn, M., and Kidd, T., J. Mater. Sci. Lett. 14, 10851088 (1995).CrossRefGoogle Scholar
22.Tahan, D., Safari, A., and Klein, L. C., Proc. of the Ninth IEEE International Symposium on Applications of Ferroelectrics, 427430 (1994).Google Scholar
23.Kim, J., Kwun, S-I., and Yoon, J-G., Proc. of the Ninth IEEE International Symposium on Applications of Ferroelectrics, 423426 (1994).Google Scholar