Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
He, S.
Zheng, T.
and
Danyluk, S.
2004.
Analysis and determination of the stress-optic coefficients of thin single crystal silicon samples.
Journal of Applied Physics,
Vol. 96,
Issue. 6,
p.
3103.
Horn, Gavin
Lesniak, Jon
Mackin, Thomas
and
Boyce, Brad
2005.
Infrared grey-field polariscope: A tool for rapid stress analysis in microelectronic materials and devices.
Review of Scientific Instruments,
Vol. 76,
Issue. 4,
Horn, G.
Mackin, T. J.
and
Lesniak, J.
2005.
Trapped particle detection in bonded semiconductors using gray-field photoelastic imaging.
Experimental Mechanics,
Vol. 45,
Issue. 5,
p.
457.
Brito, M. C.
Pereira, J. P.
Maia Alves, J.
Serra, J. M.
and
Vallera, A. M.
2005.
Measurement of residual stress in multicrystalline silicon ribbons by a self-calibrating infrared photoelastic method.
Review of Scientific Instruments,
Vol. 76,
Issue. 1,
Li, F.
Garcia, V.
and
Danyluk, S.
2006.
Full Field Stress Measurements in Thin Silicon Sheet.
p.
1245.
He, S.
Danyluk, S.
Tarasov, I.
and
Ostapenko, S.
2006.
Residual stresses in polycrystalline silicon sheet and their relation to electron-hole lifetime.
Applied Physics Letters,
Vol. 89,
Issue. 11,
Suhling, Jeffrey C.
and
Lall, Pradeep
2008.
Springer Handbook of Experimental Solid Mechanics.
p.
1015.
Spencer, Matthew L.
and
Lorenz, Robert D.
2008.
Analysis and In-Situ Measurement of Thermal-Mechanical Strain in Active Silicon Power Semiconductors.
p.
1.
Xia, S.
and
Mello, M.
2011.
Phase-Multiplied Photoelastic and Series Interferometer Arrangement for Full-Field Stress Measurement in Single Crystals.
Experimental Mechanics,
Vol. 51,
Issue. 4,
p.
653.
Prasath, R. G. R.
Skenes, K.
and
Danyluk, S.
2013.
Comparison of Phase Shifting Techniques for Measuring In-Plane Residual Stress in Thin, Flat Silicon Wafers.
Journal of Electronic Materials,
Vol. 42,
Issue. 8,
p.
2478.
Lin, T-W
Elkhatib, O
Makinen, J
Palokangas, M
Johnson, H T
and
Horn, G P
2013.
Residual stresses at cavity corners in silicon-on-insulator bonded wafers.
Journal of Micromechanics and Microengineering,
Vol. 23,
Issue. 9,
p.
095004.
Horn, Gavin P.
Lesniak, Jon R.
Mackin, Thomas J.
and
Buonassisi, Tonio
2013.
Application of Imaging Techniques to Mechanics of Materials and Structures, Volume 4.
p.
207.
Skenes, K.
Prasath, R. G. R.
and
Danyluk, S.
2014.
Residual Stress, Thermomechanics & Infrared Imaging, Hybrid Techniques and Inverse Problems, Volume 8.
p.
79.
Puro, A
and
Karov, D
2014.
Polarization tomography for residual stress measurements in a hexagonal single crystal.
Inverse Problems,
Vol. 30,
Issue. 12,
p.
125002.
Pogue, Vanessa
Melkote, Shreyes N.
Rounsaville, Brian
and
Danyluk, Steven
2017.
The effect of residual stress on photoluminescence in multi-crystalline silicon wafers.
Journal of Applied Physics,
Vol. 121,
Issue. 8,
Walecki, Wojtek J.
Wang, Qiong-Hua
Chien, Liang-Chy
and
Yoon, Tae-Hoon
2018.
Stress metrology for flat-panel displays G6 and bigger.
p.
13.
Walecki, Wojtek J
and
Hung, Wei-Chun
2018.
Full field and full tensor stress metrology for flexible electronics, packaging, and optoelectronic applications: AM: Advanced metrology.
p.
74.
Pogue, V.
Melkote, S.N.
and
Danyluk, S.
2018.
Residual stresses in multi-crystalline silicon photovoltaic wafers due to casting and wire sawing.
Materials Science in Semiconductor Processing,
Vol. 75,
Issue. ,
p.
173.
Yin, Jingfei
Bai, Qian
and
Zhang, Bi
2019.
Subsurface Damage Detection on Ground Silicon Wafers Using Polarized Laser Scattering.
Journal of Manufacturing Science and Engineering,
Vol. 141,
Issue. 10,
Wang, Zhiyong
Wu, Zhipeng
Han, Yunhui
Kang, Kai
Li, Lin'an
Li, Yuehua
Hou, Weijie
Wang, Shibing
and
Li, Chuanwei
2020.
Metal stress-optic effect and its application in stress measurement.
Thin Solid Films,
Vol. 695,
Issue. ,
p.
137755.