Hostname: page-component-586b7cd67f-rcrh6 Total loading time: 0 Render date: 2024-11-23T19:27:31.509Z Has data issue: false hasContentIssue false
  • English
  • Français

Surface Morphology Anisotropy and Stress Distribution Uniformity in Annealed Cu–W Films

Published online by Cambridge University Press:  03 March 2011

Y. Wang ,
X.-H Li ,
Y.-H Chen ,
K.-W Xu  and
D.W. Fan
Y. Wang*
Affiliation:
State-Key Laboratory for Mechanical Behavior of Materials, Xian Jiaotong University,Xian 710049, People’s Republic of China; and Department of Mechanical Engineering,Lanzhou Railway Institute, Lanzhou 730070, People’s Republic of China
X.-H Li
Affiliation:
Signal & Information Processing Lab., Beijing University of Technology,Beijing 100022, People’s Republic of China
Y.-H Chen
Affiliation:
State-Key Laboratory for Mechanical Behavior of Materials, Xian Jiaotong University,Xian 710049, People’s Republic of China
K.-W Xu
Affiliation:
State-Key Laboratory for Mechanical Behavior of Materials, Xian Jiaotong University,Xian 710049, People’s Republic of China
D.W. Fan
Affiliation:
Key Lab. of Opto-Electronic Technology & Intelligent Control, Lanzhou Railway Institute,Lanzhou 730070, People’s Republic of China
*
a)Address all correspondence to this author. e-mail: kwxu@mail.xjtu.edu.cn
Get access

Abstract

Copper-tungsten films were deposited on Si and Al2O3 substrates by magnetron sputtering and then in situ annealed in vacuum chamber at different temperatures. X-ray diffraction (XRD), scanning electron microscopy (SEM), and the polarization phase shift technique were used to characterize the microstructure, surface morphology, and residual stress of Cu–W films. The results indicated that there are two successive but distinctive stages of phase transition with the change of annealing temperatures. The evolution of surface morphology of Cu–W thin films shows a significant effect on the distribution of in-plane stresses. A strategy of integrating discrete wavelet transform and fractal geometry concepts was developed to analyze the anisotropy of surface structure of Cu–W thin films. The correlation between the anisotropy of surface morphology and the stress distribution of thin films was constructed. It is found that the stress distribution of the thin films is sensitive to the variations of the anisotropy of the surface structure with annealing temperature. The variation in the uniformity of in-plane stress distribution with the evolution of surface structure of thin films is independent of the choice of substrate materials.

Keywords

MorphologyPhase transformationThin film
Type
Articles
Information
Journal of Materials Research , Volume 20 , Issue 1 , January 2005 , pp. 151 - 160
Copyright
Copyright © Materials Research Society 2004

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1McRae, G.A., Maguire, M.A., Jeffrey, C.A., Guzonas, D.A. and Brown, C.A.: A comparison of fractal dimensions determined from atomic force microscopy and impedance spectroscopy of anodic oxides on Zr–2.5Nb. Appl. Surf. Sci. 191, 94 (2002).CrossRefGoogle Scholar
2Ming, Q., Zai, P. and Friedrich, K.: On the wear debris of polyetheretherketone: Fractal dimensions in relation to wear mechanisms. Tribol. Int. 30, 87 (1997).Google Scholar
3Jong, C-A. and Chin, T.S.: Optical characteristics of sputtered tantalum oxynitride Ta(N,O) films. Mater. Chem. Phys. 74, 201 (2002).Google Scholar
4Luth, H.: Solid Surfaces, Interfaces and Thin Films (Springer, New York, 2001).Google Scholar
5Barabasi, A-L. and Stanly, H.E.: Fractal Concepts in Surface Growth (Cambridge University Press, Cambridge, U.K., 1995).Google Scholar
6Leamy, H.J. and Dirks, A.G.: Microstructure and magnetism in amorphous rare-earth–transition-metal thin films. I. Microstructure. J. Appl. Phys. 49, 3430 (1978).CrossRefGoogle Scholar
7Messier, Russell: Toward quantification of thin film morphology. J. Vac. Sci. Technol. A 4, 490 (1986).Google Scholar
8Nix, W.D.: The mechanical properties of thin films. Metall. Trans. A 20, 2217 (1989).Google Scholar
9Brongersma, S.H., Castell, M.R., Perovic, D.D. and Zinke-Allmang, M.: Stress-induced shape transition of CoSi2 clusters on Si(100). Phys. Rev. Lett. 80, 3795 (1998).CrossRefGoogle Scholar
10Trofimov, I.V.: Morphology evolution in a growing film. Thin Solid Films 428, 56 (2003).Google Scholar
11Cruz, T.G. Souza, Kleinke, M.U. and Gorenstein, A.: Evidence of local and global scaling regimes in thin films deposited by sputtering: An atomic force microscopy and electrochemical study. Appl. Phys. Lett. 81, 4922 (2002).CrossRefGoogle Scholar
12Geyer, U., von Hulsen, U. and Kopf, H.: Internal interfaces and intrinsic stress in thin amorphous Cu-Ti and Co-Tb films. J. Appl. Phys. 83, 3065 (1998).Google Scholar
13Engelhardt, M.A., Jaswal, S.S. and Sellmyer, D.J.: Photoemission and electronic structure of tungsten-based metallic glasses and alloys. Phys. Rev. B 44, 12671 (1991).Google Scholar
14Stoyanov, H.Y.: Polarization interferometer as a proximity sensor. Opt. Laser Technol. 32, 147 (2000).Google Scholar
15Debnath, L.: Wavelet Transforms and Their Applications (New York, Birkhauser Boston, Boston, MA, 2002).Google Scholar
16Mallat, S.G.: A theory for multiresolution signal decomposition: The wavelet representation. IEEE Trans. Pattern Anal. Mach. Intell. 11, 674 (1989).CrossRefGoogle Scholar
17John, R.: Fractal Surfaces (Plenum Press, New York and London, 1994), p. 77.Google Scholar
18Li, J.M., Lu, L., Su, Y. and Lai, M.O.: Self-affine nature of thin film surface. Appl. Surf. Sci. 161, 187 (2000).Google Scholar
19Babadagli, T. and Develi, K.: On the application of the methods used to calculate the fractal dimension of fracture surface. Fractals 9, 105 (2001).Google Scholar
20Grzeta, B., Radic, N., Gracin, D., Doslic, T. and Car, T.: Crystallization of Cu50W50 and Cu66W34 amorphous alloys. J. Non-Cryst. Solids 170, 101 (1994).Google Scholar
21Dirks, A.G. and van den Broek, J.J.: Metastable solid solutions in vapor deposited Cu–Cr, Cu–Mo, and Cu–W thin films. J. Vac. Sci. Technol. A 3, 2618 (1985).Google Scholar
22Chopra, K.L.: Thin Film Phenomena (McGraw-Hill, New York, 1969), p. 199.Google Scholar
23Radic, N. and Stubicar, M.: Microhardness properties of Cu–W amorphous thin films. J. Mater. Sci. 33, 3401 (1998).Google Scholar
24van Zutphen, A.J.M.M., Sutta, P., Tichelaar, F.D., von Keitz, A., Zeman, M. and Metselaar, J.W.: Structure of thin polycrystalline silicon films on ceramic substrates. J. Cryst. Growth 223, 332 (2001).Google Scholar
25Teixeira, V.: Mechanical integrity in PVD coatings due to the presence of residual stresses. Thin Solid Films 392, 276 (2001).Google Scholar
26Seal, K., Nelson, M.A. and Ying, C.Z.: Growth, morphology, and optical and electrical properties of semicontinuous metallic films. Phys. Rev. B 67, 035318 (2003).Google Scholar
27Ozkan, C.S., Nix, W.D. and Gao, H.: Stress-driven surface evolution in heteroepitaxial thin films: Anisotropy of the two-dimensional roughening mode. J. Mater. Res. 14, 3247 (1999).CrossRefGoogle Scholar
28Nix, W.D. and Clemens, B.M.: Crystallite coalescence: A mechanism for intrinsic tensile stresses in thin films. J. Mater. Res. 14, 3467 (1999).Google Scholar
29Zinke-Allmang, M.: Phase separation on solid surfaces: Nucleation, coarsening and coalescence kinetics. Thin Solid Films 346, 1 (1999).CrossRefGoogle Scholar