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Young's modulus and tensile strength of CuNi(Mn) thin films on polyimide foils by tensile testing

Published online by Cambridge University Press:  31 January 2011

F. Macionczyk ,
W. Brückner ,
W. Pitschke  and
G. Reiss
F. Macionczyk
Affiliation:
Institute of Solid State and Materials Research Dresden, D-01171 Dresden, Germany
W. Brückner
Affiliation:
Institute of Solid State and Materials Research Dresden, D-01171 Dresden, Germany
W. Pitschke
Affiliation:
Institute of Solid State and Materials Research Dresden, D-01171 Dresden, Germany
G. Reiss
Affiliation:
Institute of Solid State and Materials Research Dresden, D-01171 Dresden, Germany
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Abstract

Force-strain curves were measured for 1.0 μm and 1.5 μm thick Cu0.57Ni0.42Mn0.01 films on 8 μm thick polyimide foils by tensile testing. By separating the force working on the polyimide foil from that working on the metal-polyimide compound, stress-strain curves for the CuNi(Mn) films were obtained. Young's modulus and tensile strength were determined for as-deposited and annealed [350 °C, 1 h, N2/H2(5 vol%) atmosphere] films by this method. Crack propagation starts at the end of the elastic region at 0.2 to 0.7% strain, depending on the film thickness and the thermal treatment. The cracking behavior is described by a steady-state approximation.

Type
Articles
Information
Journal of Materials Research , Volume 13 , Issue 10 , October 1998 , pp. 2852 - 2858
Copyright
Copyright © Materials Research Society 1998

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