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Anomalous wetting of Ti–48 at.% Al–2 at.% Cr–2 at.% Nb substrates by liquid copper

Published online by Cambridge University Press:  31 January 2011

W. F. Gale ,
Y. Shen ,
J. W. Fergus  and
X. Wen
W. F. Gale
Affiliation:
Materials Research and Education Center, Auburn University, 201 Ross Hall, Auburn, Alabama 36849
Y. Shen
Affiliation:
Materials Research and Education Center, Auburn University, 201 Ross Hall, Auburn, Alabama 36849
J. W. Fergus
Affiliation:
Materials Research and Education Center, Auburn University, 201 Ross Hall, Auburn, Alabama 36849
X. Wen
Affiliation:
Materials Research and Education Center, Auburn University, 201 Ross Hall, Auburn, Alabama 36849
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Abstract

Conventionally, the wetting of metallic substrates by liquid metals involves undermining of the substrate–oxide layer by the liquid. Evidence is presented here for an alternative wetting process involving spreading of liquid copper along the exterior of the oxide layer on Ti–48 at.% Al–2 at.% Cr–2 at.% Nb substrates. A mechanism is presented that involves compositional changes in the liquid, which in turn allow a wetting-promoting reaction between the (initially unreactive) liquid and the exterior layer of the substrate oxide.

Type
Articles
Information
Journal of Materials Research , Volume 14 , Issue 10 , October 1999 , pp. 3889 - 3894
Copyright
Copyright © Materials Research Society 1999

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