Hostname: page-component-78c5997874-ndw9j Total loading time: 0 Render date: 2024-11-19T13:05:00.577Z Has data issue: false hasContentIssue false
  • English
  • Français

High-tensile ductility in nanocrystalline copper

Published online by Cambridge University Press:  31 January 2011

L. Lu ,
L. B. Wang ,
B. Z. Ding  and
K. Lu
L. Lu
Affiliation:
State Key Laboratory for RSA, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110015, People's Republic of China
L. B. Wang
Affiliation:
State Key Laboratory for RSA, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110015, People's Republic of China
B. Z. Ding
Affiliation:
State Key Laboratory for RSA, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110015, People's Republic of China
K. Lu*
Affiliation:
State Key Laboratory for RSA, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110015, People's Republic of China
*
a) Author to whom correspondence should be addressed.kelu@imr.ac.cn
Get access

Abstract

In this work we report a high-tensile ductility in a fully dense bulk nanocrystalline (nc) pure copper sample prepared by electrodeposition. A tensile ductility with an elongation to fracture of 30% was obtained in the nc Cu specimen with an average grain size of 27 nm, which is comparable to that for the coarse-grained polycrystalline Cu. An enhanced yield stress (119 MPa) and a depressed strain hardening exponent (0.22) were observed in the nc Cu sample with respect to the conventional polycrystalline Cu. The high-tensile ductility was attributed to the minimized artifacts in the nc sample, and the grain-boundary sliding deformation mechanism resulted from the numerous amount small-angle grain boundaries and the low microstrain (dislocation density).

Type
Articles
Information
Journal of Materials Research , Volume 15 , Issue 2 , February 2000 , pp. 270 - 273
Copyright
Copyright © Materials Research Society 2000

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Bohn, R., Haubopld, T., Birringer, R., and Gleiter, H., Scr. Metall. Mater. 25, 811 (1991).CrossRefGoogle Scholar
2.Sanders, P.G., Eastman, J.A., and Weertman, J.R., in Processing and Properties of Nanocrystalline Materials, edited by Suryanarayana, C., Singh, J., and Froes, F.H. (TMS, Warrendale, PA, 1996), p. 379.Google Scholar
3.Koch, C.C, Morris, D., Lu, K., and Inoue, A., MRS Bull. 24(2), 54 (1999).CrossRefGoogle Scholar
4.Wang, N., Wang, Z., Aust, K.T., and Erb, U., Mater. Sci. Eng. A 237, 150 (1997).CrossRefGoogle Scholar
5.Sanders, P.G., Eastman, J.A., and Weertman, J.R., Acta Mater. 45, 4019 (1997).CrossRefGoogle Scholar
6.Youngdahl, C.J., Sanders, P.G., Eastman, J.A., and Weertman, J.R., Scr. Mater. 37, 809 (1997).CrossRefGoogle Scholar
7.Erb, U., El-Sherik, A.M., Palumbo, G., and Aust, K.T., Nanostruct. Mater. 2, 383 (1993).CrossRefGoogle Scholar
8.Klug, H.P. and Alexander, L.E., X-ray Diffraction Procedures for Polycrystalline and Amorphous Materials (John Wiley and Sons, New York, 1974), p. 618.Google Scholar
9.Sui, M.L., Lu, L., and Lu, K. (unpublished).Google Scholar
10.Hertzberg, R.W., Deformation and Fracture Mechanism of Engineering Materials, 2nd ed. (John Wiley and Sons, New York, 1983), p. 17.Google Scholar
11.Nieman, G.W., Weertman, J.R., and Siegel, R.W., J. Mater. Res. 6, 1012 (1991).CrossRefGoogle Scholar
12.Siegel, R.W. and Fougere, G.E., in Nanophase Materials, edited by Hadjipanayis, G.C. and Siegel, R.W. (Kluwer, Dordrecht, The Netherlands, 1994), p. 233.CrossRefGoogle Scholar
13.Koch, C.C., Nanostruct. Mater. 2, 109 (1993).CrossRefGoogle Scholar
14.Schiotz, J., Di Tolla, F.D., and Jacobsoen, K.W., Nature 391, 561 (1998).CrossRefGoogle Scholar
15.Cai, B., Kong, Q.P., Lu, L., and Lu, K., Scr. Metall. 41, 755 (1999).CrossRefGoogle Scholar