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Surface exfoliation analysis on single-crystal silicon under compressed plasma flow action

Published online by Cambridge University Press:  12 March 2018

J. Shen
Affiliation:
School of Physics and Nuclear Energy Engineering, Beihang University, Beijing 100191, China International Research Center for Nuclei and Particles in Cosmos, Beihang University, Beijing 100191, P.R. China Beijing Key Laboratory of Advanced Nuclear Energy Materials and Physics, Beihang University, Beijing 100191, China
I. Shahid
Affiliation:
School of Physics and Nuclear Energy Engineering, Beihang University, Beijing 100191, China
X. Yu
Affiliation:
School of Physics and Nuclear Energy Engineering, Beihang University, Beijing 100191, China Tomsk Polytechnic University, Tomsk 634050, Russia
J. Zhang
Affiliation:
School of Physics and Nuclear Energy Engineering, Beihang University, Beijing 100191, China
H.W. Zhong
Affiliation:
School of Physics and Nuclear Energy Engineering, Beihang University, Beijing 100191, China
X. Yu
Affiliation:
School of Physics and Nuclear Energy Engineering, Beihang University, Beijing 100191, China
W.Y. Huang
Affiliation:
School of Physics and Nuclear Energy Engineering, Beihang University, Beijing 100191, China
G.Y. Liang
Affiliation:
School of Physics and Nuclear Energy Engineering, Beihang University, Beijing 100191, China
X.J. Cui
Affiliation:
School of Physics and Nuclear Energy Engineering, Beihang University, Beijing 100191, China
S. Yan
Affiliation:
Institute of Heavy Ion Physics, Peking University, Beijing 100871, P.R. China
X.F. Zhang
Affiliation:
School of Physics and Nuclear Energy Engineering, Beihang University, Beijing 100191, China
X.Y. Le*
Affiliation:
School of Physics and Nuclear Energy Engineering, Beihang University, Beijing 100191, China International Research Center for Nuclei and Particles in Cosmos, Beihang University, Beijing 100191, P.R. China Beijing Key Laboratory of Advanced Nuclear Energy Materials and Physics, Beihang University, Beijing 100191, China
*
Author for correspondence: X.Y. LE, School of Physics and Nuclear Energy Engineering, Beihang University, Beijing 100191, China. E-mail: xyle@buaa.edu.cn

Abstract

Surface exfoliation was observed on single-crystal silicon surface under the action of compressed plasma flow (CPF). This phenomenon is mainly attributed to the strong transient thermal stress impact induced by CPF. To gain a better understanding of the mechanism, a micro scale model combined with thermal conduction and linear elastic fracture mechanics was built to analyze the thermal stress distribution after energy deposition. After computation with finite element method, J integral parameter was applied as the criterion for fracture initiation evaluation. It was demonstrated that the formation of surface exfoliation calls for specific material, crack depth, and CPF parameter. The results are potentially valuable for plasma/matter interaction understanding and CPF parameter optimization.

Type
Research Article
Copyright
Copyright © Cambridge University Press 2018 

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