No CrossRef data available.
Article contents
Numerical simulation of cooling electronic components mounted in a vertical wall by natural convection
Published online by Cambridge University Press: 07 April 2014
Abstract
This paper is a numerical work to investigate thermal interactions between heat fluxes generated by electronic devices mounted on a vertical printed circuit board (PCB). In fact, the effect of some parameters such as Grashof number (Gr), the distance (S) between the heat sources and the upper exit distance (Le) was studied. The results show that a regular and uniform heat sources distribution in the inlet is very important in order to take advantage from the leading edge of the boundary layer and to obtain the necessary heat dissipation. The impact of parameters on the heat dissipation, characterized by the Nusselt number, has a different importance. For a Prandtl number Pr = 0.71, the (Gr) increases the heat exchange that is reflected by the increase of Nusselt number, and also participates to the formation of recirculation zones. The total Nusselt number Nu is increased when (Gr) is multiplied by 102. With regards to the distance (S) between the heat sources, the results show that Nu increases about 7% if the distance (S) doubles, and becomes approximately 17.8% when (S) quadruples. At the end, the heat transfer increases when increasing the distance (Le) of the upper exit length, especially on the second component. The total Nusselt number increases by 1.6% when (Le) increases by about 67%.
Keywords
- Type
- Research Article
- Information
- Copyright
- © AFM, EDP Sciences 2014
References
Yeh, L.T., Review of Heat Transfer
Technologies in Electronic Equipment, ASME Journal of
Electronics Packaging
117 (1995) 333–339
CrossRefGoogle Scholar
Behnia, M., Dehghan, A.A., Mishima, H., Nakayama, W., Convection Cooling of a Heated
Obstacle in a Channel, Int. J. Heat Mass Transfer
41 (1998) 3131–3148
Google Scholar
Wang, H., Penot, F., Saulnier, J., Numerical Study of a
Buoyancy-induced Flow Along a Vertical Plate with Discretely Heated Integrated Circuit
Packages, Int. J. Heat Mass Transfer
40 (1997) 509–1520
CrossRefGoogle Scholar
Ramón, L.F., Berbakow, O., Natural Convection in Cubical
Enclosures with Thermal Sources on Adjacent Vertical Walls, Numerical Heat
Transfer, Part A
4 (2002) 331–340
Google Scholar
Dias, T.J.R., Milanez, L.F., Natural Convection Due to a
Heat Source on a Vertical Plate, Int. J. Heat Mass
Transfer
47 (2004) 1227–1232
CrossRefGoogle Scholar
da Silva, A.K., Lorenzini, S., Bejan, A., Distribution of Heat Sources in
Vertical Open Channels with Natural Convection, Int. J. Heat
Mass Transfer
48 (2005) 1462–1469
CrossRefGoogle Scholar
R. Comunelo, S. Güths, Natural Convection at
Isothermal Vertical Plate, neighborhood influence, 18th International Congress of
Mechanical Engineering, November 6-11, Ouro Preto, MG. 2005
Bhowmic, H., Tou, K., Experimental Study of Transient
Natural Convection Heat Transfer from Simulated Electronic Chips,
Exp. Thermal Fluid Sci.
29 (2005) 485–492
CrossRefGoogle Scholar
Icoz, T., Jaluria, Y., Numerical Simulation of
Boundary Conditions and the Onset of Instability in Natural Convection Due to Protruding
Thermal Sources in an Open Rectangular Channel, Numerical Heat Transfer,
Part A
48 (2005) 831–347
Google Scholar
Nadar, S., Natural Convection Heat Transfer
in Horizontal and Vertical Closed Narrow Enclosures with Heated Rectangular Finned Base
Plate, Int. J. Heat Mass Transfer
50 (2006) 667–679
CrossRefGoogle Scholar
Harvest, J., Fleischer, A., Weinstein, R., Modeling of the Thermal
Effects of Heat Generating Devices in Close Proximity on Vertically Oriented Printed
Circuit Boards for Thermal Management Applications, Int. J.
Thermal Sci.
46 (2007) 253–261 CrossRefGoogle Scholar
A. Bejan, Convection heat transfer,
3rd edition, John Wiley and
Sons, New York, 2004
S.V. Patankar, Numerical heat transfer and fluid
flow, Hemisphere, Washington. DC, 1980