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Effect of Crystallographic Orientation on Subcritical Grain Boundary Cracking in a Conventionally Cast Polycrystalline Nickel-Based Superalloy

Published online by Cambridge University Press:  30 May 2013

Kameshwaran Swaminathan ,
John E. Blendell  and
Kevin P. Trumble
Kameshwaran Swaminathan*
Affiliation:
School of Materials Engineering, Purdue University, 701 W. Stadium Avenue, West Lafayette, IN 47906, USA
John E. Blendell
Affiliation:
School of Materials Engineering, Purdue University, 701 W. Stadium Avenue, West Lafayette, IN 47906, USA
Kevin P. Trumble
Affiliation:
School of Materials Engineering, Purdue University, 701 W. Stadium Avenue, West Lafayette, IN 47906, USA
*
*Corresponding author. E-mail: kamesh@purdue.edu; quarterengineer@gmail.com
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Abstract

The role of grain orientation and grain boundary misorientation on the formation of subcritical grain boundary cracks in creep of a conventionally cast nickel-based superalloy has been studied. The crystallographic orientations of the grains adjacent to grain boundaries normal to the tensile axis were measured using electron backscattered diffraction. The difference in the Schmid factor for the {111} ⟨112⟩ slip system between the grains was compared to the occurrence of grain boundary cracking. In addition, the difference in the amount of potential primary creep was calculated. The cracked grain boundaries were found to have a larger difference in Schmid factor, as well as a larger difference in potential primary creep, compared with uncracked grain boundaries.

Keywords

Ni-based superalloycreepgrain boundary crackingelectron backscattered diffraction
Type
EBSD Special Section
Information
Microscopy and Microanalysis , Volume 19 , Issue 4 , August 2013 , pp. 978 - 987
Copyright
Copyright © Microscopy Society of America 2013 

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