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HRTEM Image Simulations of Structural Defects in Gate Oxides
Published online by Cambridge University Press: 02 July 2020
Extract
High-resolution transmission electron microscopy (HRTEM) is used extensively in the semiconductor industry for device characterization, and has become one of the highly favored techniques for characterizing the latest generation of ultra-thin gate oxides in MOSFET devices. However, relatively little is understood (either quantitatively or experimentally) about the limitations of HRTEM in detecting structural defects in gate oxides that could affect device performance. To investigate model defects experimentally, it would be necessary to construct “perfect” gate oxides, introduce defects with size and morphology known perfectly a priori, successfully make thin specimens that capture the defects, and then perform imaging experiments in the HRTEM. Since that task is virtually impossible, we have performed HRTEM image simulations to assess the visibility of various structural defects in gate oxides. The gate oxide was modeled as an amorphous silicon oxide 16.3Å-thick, sandwiched between a gate and substrate. The substrate was (100) silicon viewed along the [110] direction.
- Type
- Semiconductors
- Information
- Microscopy and Microanalysis , Volume 6 , Issue S2: Proceedings: Microscopy & Microanalysis 2000, Microscopy Society of America 58th Annual Meeting, Microbeam Analysis Society 34th Annual Meeting, Microscopical Society of Canada/Societe de Microscopie de Canada 27th Annual Meeting, Philadelphia, Pennsylvania August 13-17, 2000 , August 2000 , pp. 1078 - 1079
- Copyright
- Copyright © Microscopy Society of America