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Microstructure Of Au/Ti Ohmic Contacts On n-GaN
Published online by Cambridge University Press: 02 July 2020
Extract
GaN is a semiconductor with a direct band-gap of 3.4 eV which has a potential application in optoelectronic devices such as UV-emitting lasers and blue light emitting diodes. Extensive efforts have been made to develop low-resistance, thermally stable and uniform ohmic contacts on GaN. In this study, n-GaN films (Si-doped) with an intermediate A1N buffer layer were grown on 6H-SiC substrates via MOVPE. The contacts were formed by depositing Ti and then Au films on GaN by e-beam evaporation at room temperature. Current-voltage measurements as a function of temperature showed that the ohmicity of the Au/Ti contact improved upon annealing, corresponding to changes in the microstructure of the contact interfaces involving a redistribution of nitrogen and gold.
Fig. 1 shows the microstructure of the as-deposited Au/Ti/GaN films. The nanocrystalline Ti film was about 50 nm thick. Au film was polycrystalline, containing many growth twins. The thickness of Au film varied from 260 to 350 nm.
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- Microscopy of Semiconducting and Superconducting Materials
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- Copyright © Microscopy Society of America
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