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TEM Study of Surface Damage and Profile of a FIB-Prepared Si Sample

Published online by Cambridge University Press:  01 August 2004

Shixin X Wang
Shixin X Wang
Affiliation:
Micron Technology, Boise, Idaho
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Extract

Extended abstract of a paper presented at Microscopy and Microanalysis 2004 in Savannah, Georgia, USA, August 1–5, 2004.

Type
Research Article
Information
Microscopy and Microanalysis , Volume 10 , Issue S02 , August 2004 , pp. 1158 - 1159
Copyright
© 2004 Microscopy Society of America

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