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Analysis of Thin Film Specimens Using ToF-SIMS Wedge Protocol, A Comparison with Depth Profiling

Published online by Cambridge University Press:  30 July 2021

Vincent Smentkowski ,
Shubhodeep Goswami ,
Felix Kollmer ,
Julia Zakel ,
Henrik Arlinghaus  and
Derk Rading
Vincent Smentkowski
Affiliation:
General Electric - Research, Niskayuna, New York, United States
Shubhodeep Goswami
Affiliation:
GE Reserach, United States
Felix Kollmer
Affiliation:
IonTof GmbH, Germany
Julia Zakel
Affiliation:
IonTof GmbH, United States
Henrik Arlinghaus
Affiliation:
IonTof GmbH, United States
Derk Rading
Affiliation:
IonTof GmbH, United States

Abstract

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Type
Microscopy and Microanalysis for Real World Problem Solving
Information
Microscopy and Microanalysis , Volume 27 , Supplement S1 , August 2021 , pp. 1564 - 1565
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Copyright
Copyright © The Author(s), 2021. Published by Cambridge University Press on behalf of the Microscopy Society of America

References

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