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The Case of the Overcooked Solder: Failure Analysis of AuSn Solder Die Attach using Optical and Electron Microscopy and EDS

Published online by Cambridge University Press:  01 August 2005

T Barbieri  and
B Condie
T Barbieri
Affiliation:
Freescale Semiconductor,Inc.
B Condie
Affiliation:
Freescale Semiconductor,Inc.

Extract

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Extended abstract of a paper presented at Microscopy and Microanalysis 2005 in Honolulu, Hawaii, USA, July 31--August 4, 2005

Type
Research Article
Information
Microscopy and Microanalysis , Volume 11 , Issue S02 , August 2005 , pp. 1602 - 1603
Copyright
© 2005 Microscopy Society of America