Hostname: page-component-77c89778f8-7drxs Total loading time: 0 Render date: 2024-07-18T22:28:20.120Z Has data issue: false hasContentIssue false
  • English
  • Français

Characterization of Ni/Ti interlayer foil to assist diffusion bonding.

Published online by Cambridge University Press:  10 September 2015

O Emadinia ,
S Simões ,
F Viana  and
M.F Vieira
O Emadinia*
Affiliation:
CEMUC Department of Metallurgy and Materials Engineering, University of Porto, R. Dr. Roberto Frias, 4200-465 Porto, Portugal
S Simões
Affiliation:
CEMUC Department of Metallurgy and Materials Engineering, University of Porto, R. Dr. Roberto Frias, 4200-465 Porto, Portugal
F Viana
Affiliation:
CEMUC Department of Metallurgy and Materials Engineering, University of Porto, R. Dr. Roberto Frias, 4200-465 Porto, Portugal
M.F Vieira
Affiliation:
CEMUC Department of Metallurgy and Materials Engineering, University of Porto, R. Dr. Roberto Frias, 4200-465 Porto, Portugal
*
E-mail: emt10005@fe.up.pt

Abstract

An abstract is not available for this content so a preview has been provided. As you have access to this content, a full PDF is available via the ‘Save PDF’ action button.
Image of the first page of this content. For PDF version, please use the ‘Save PDF’ preceeding this image.'
Type
Material Sciences
Information
Microscopy and Microanalysis , Volume 21 , Supplement S6: Introduction to the SPMicros Special Issue from the XLVII Annual Congress , August 2015 , pp. 120 - 121
Copyright
Copyright © Microscopy Society of America 2015 

References

[1]Simões, S., et al. (2013). Materials Science 48, 7718–7727.Google Scholar