Hostname: page-component-7bb8b95d7b-2h6rp Total loading time: 0 Render date: 2024-10-05T22:24:20.314Z Has data issue: false hasContentIssue false

Imaging Biological Specimens by STEM-in-SEM and Comparison with TEM

Published online by Cambridge University Press:  22 July 2022

Erich Müller*
Affiliation:
Karlsruhe Institute of Technology (KIT), Laboratory for Electron Microscopy (LEM), Engesserstraße 7, 76131 Karlsruhe, Germany
Milena Hugenschmidt
Affiliation:
Karlsruhe Institute of Technology (KIT), Laboratory for Electron Microscopy (LEM), Engesserstraße 7, 76131 Karlsruhe, Germany Karlsruhe Institute of Technology (KIT), 3DMM2O - Cluster of Excellence (EXC-2082/1–390761711), 76131 Karlsruhe, Germany
Heike Störmer
Affiliation:
Karlsruhe Institute of Technology (KIT), Laboratory for Electron Microscopy (LEM), Engesserstraße 7, 76131 Karlsruhe, Germany
Lukas Grünewald
Affiliation:
Karlsruhe Institute of Technology (KIT), Laboratory for Electron Microscopy (LEM), Engesserstraße 7, 76131 Karlsruhe, Germany
Susanne Fritsch-Decker
Affiliation:
Karlsruhe Institute of Technology (KIT), Institute of Biological and Chemical Systems-Biological Information Processing, Hermann-von-Helmholtz-Platz 1, 76344 Eggenstein-Leopoldshafen, Germany
Carsten Weiss
Affiliation:
Karlsruhe Institute of Technology (KIT), Institute of Biological and Chemical Systems-Biological Information Processing, Hermann-von-Helmholtz-Platz 1, 76344 Eggenstein-Leopoldshafen, Germany
Dagmar Gerthsen
Affiliation:
Karlsruhe Institute of Technology (KIT), Institute of Biological and Chemical Systems-Biological Information Processing, Hermann-von-Helmholtz-Platz 1, 76344 Eggenstein-Leopoldshafen, Germany
*
*Corresponding author: erich.mueller@kit.edu

Abstract

Image of the first page of this content. For PDF version, please use the ‘Save PDF’ preceeding this image.'
Type
Surface and Subsurface Microscopy and Microanalysis of Physical and Biological Specimens
Copyright
Copyright © Microscopy Society of America 2022

References

Kaiser, U et al. , Ultramicroscopy 111 (2011), p. 1239. doi: 10.1016/j.ultramic.2011.03.012CrossRefGoogle Scholar
Egerton, RF, Micron 119 (2019), p.72. doi: 10.1016/j.micron.2019.01.005CrossRefGoogle Scholar
Holm, J, Electronic Device Failure Analysis [Online] 23 (2021), https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=932860 (accessed February 15, 2022)Google Scholar
Sun, C et al. , Journal of Materials Science 55 (2020), p. 13824. doi: https://doi.org/10.1007/s10853-020-04970-3CrossRefGoogle Scholar
Kowoll, T et al. , Scanning 2017 (2017), p. 4907457. doi: https://doi.org/10.1155/2017/4907457CrossRefGoogle Scholar
Carter, CB and Williams, DB, “Transmission Electron Microscopy”, Plenum Press, New York (1996)Google ScholarPubMed
Timischl, F, Scanning 37 (2015), p. 54. doi: 10.1002/sca.21179CrossRefGoogle ScholarPubMed
We acknowledge funding by the Deutsche Forschungsgemeinschaft (DFG, German Research Foundation) under Germany's Excellence Strategy – 2082/1–390761711Google Scholar