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Lab-based Nanoscale 3D X-Ray Microscopy for Failure Analysis on Advanced Semiconductors
Published online by Cambridge University Press: 10 August 2018
Abstract
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- Microscopy and Microanalysis , Volume 24 , Supplement S2: Proceedings of the 14th International Conference on X-ray Microscopy (XRM2018) , August 2018 , pp. 196 - 197
- Copyright
- © Microscopy Society of America 2018
References
[1] Schmidt, C., et al, Use of 3D X-Ray Microscopy for BEOL and Advanced Packaging Failure Analysis, International Symposium for Testing and Failure Analysis (ISTFA), (2017).Google Scholar
[3] Augur, R. The struggle to keep scaling BEOL, and what we can do next, IEEE International Electronic Device Meeting (IEDM) (2016).Google Scholar
[4] Schmidt, C., et al, Use of 3D X-Ray Microscopy for BEOL and Advanced Packaging Failure Analysis, International Symposium for Testing and Failure Analysis (ISTFA), (2017)..Google Scholar
[5] Schmidt, C., et al, Novel sample preparation and High-Resolution X-ray tomography for Package FA, International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), (2017).Google Scholar
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