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Using 3D Nanotomography to Visualize Defects in the Fabrication of Superconducting Electronics

Published online by Cambridge University Press:  23 September 2015

Aric W. Sanders
Affiliation:
.National Institute of Standards and Technology, Boulder Colorado, USA.
Anna E. Fox
Affiliation:
.National Institute of Standards and Technology, Boulder Colorado, USA.
Paul D. Dresselhaus
Affiliation:
.National Institute of Standards and Technology, Boulder Colorado, USA.

Abstract

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Type
Abstract
Copyright
Copyright © Microscopy Society of America 2015 

References

References:

[1] Fox, AE, Dresselhaus, PD, Rufenacht, A, Sanders, A & Benz, SP, IEEE Transactions on Applied Superconductivity 99 (2014) 10.1109.Google Scholar
[2] Steve, R. & Robert, P., Journal of Micromechanics and Microengineering 11 (2001). p 287.Google Scholar
[3] Sanders, A, Fox, A, Dresselhaus, P & Curtin, A, Microscopy and Microanalysis 20 (2014). p 772773.Google Scholar
[4] Schmid, B, Schindelin, J, Cardona, A, Longair, M & Heisenberg, M, BMC Bioinformatics 11 (2010) 274.Google Scholar