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Xe plasma FIB Delayering of IC based on 14 nm node technology

Published online by Cambridge University Press:  25 July 2016

Jozef Vincenc Oboňa ,
Tomáš Hrnčíř ,
Sharang ,
Marek Šikula  and
Andrey Denisyuk
Jozef Vincenc Oboňa
Affiliation:
TESCAN Brno, s.r.o., Libusina trida 1, Brno, Czech Republic
Tomáš Hrnčíř
Affiliation:
TESCAN Brno, s.r.o., Libusina trida 1, Brno, Czech Republic
Sharang
Affiliation:
TESCAN Brno, s.r.o., Libusina trida 1, Brno, Czech Republic
Marek Šikula
Affiliation:
TESCAN Brno, s.r.o., Libusina trida 1, Brno, Czech Republic
Andrey Denisyuk
Affiliation:
TESCAN ORSAY HOLDING, Libušina tfida 21, Brno, Czech Republic

Abstract

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Type
Abstract
Information
Microscopy and Microanalysis , Volume 22 , Supplement S3: Proceedings of Microscopy & Microanalysis 2016 , July 2016 , pp. 56 - 57
Copyright
© Microscopy Society of America 2016 

References

[1] http://www.itrs2.net/.Google Scholar
[2] http://www.intel.com/content/www/us/en/silicon-innovations/intel-14nm-technology.html.Google Scholar
[3] Hrnčíř, T, et al, 38th ISTFA Conf. Proc (2012). p. 26.Google Scholar
[4] Delobbe, A, et al, Microsc. and Microanal 20 (2014) 298.Google Scholar
[5] Hrnčíř, T, et al, 41th ISTFA Conf. Proc (2015). p. 60.Google Scholar