A large part of the preparation of semiconductor samples for SEM and TEM observations involves the creation of cross sections to expose subsurface defects and three-dimensional structure. A powerful new combination of FIB (FEI Company, Hillsboro, Oregon, http://www.feic.com ) with automated microcleaving technology (SELA, Santa Clara, California, http://www. sela.com ) now offers a comprehensive solution for fast, easy and accurate sample preparation.