The planarizing technique of materials lapping and polishing shows many benefits in providing samples for optical microscopy in failure analysis, quality control and related fields. A method is described below which provides both rapid and accurate micro-sections of pcb's, wafers, packaged components and other processed materials, with the use of a novel approach involving a 'calibrated' polishing base and a 'Micropositioner' head. Other benefits include the ability to halt material removal at a predetermined process endpoint and convenient sample mounting techniques.