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Using a Focused Ion Beam (FIB) System to Extract TEM-Ready Samples from Complex Metallic and Ceramic Structures

Published online by Cambridge University Press:  14 March 2018

Lucille A. Giannuzzi
Affiliation:
University of Central Florida
Richard Young
Affiliation:
FE1 Company Fred Stevie Cirent Semiconductor (a partnership with Lucent Technologies)
Pete Carleson
Affiliation:
FE1 Company Fred Stevie Cirent Semiconductor (a partnership with Lucent Technologies)

Abstract

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Driven by the analytical needs of microelectronics, magnetic media and micro-fabrication industries, focused ion beam (FIB) systems are now capable of milling and manipulating samples for the analysis of microstructure features having dimensions of 180 nm or less, A technique for locating and extracting site specific specimens for examination by transmission electron microscopy (TEM) has been developed. An identified feature can be located and precisely milled with an FIB system from two sides to prepare an ultrathin sample, and then extracted from the region with a glass rod micromanipulator onto a grid for TEM analysis. This specimen preparation method has been applied to semiconductor failure analysis and to the study of metallic and ceramic microsiructures with irregular topographies and complex mufti-layered components.

Type
Research Article
Copyright
Copyright © Microscopy Society of America 1999

References

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