A precision sectioning method is described in which the diamond blade used is specifically mounted at high tension, with the sample being fed into the blade at its inner annulus. The sawing action which results is characterized by low kerf losses, the possibility for thin slices, good surface finish, high straightness, high reproducibility and low damage. Applications which benefit from the method are mentioned, namely in the sample preparation of semiconductor, geological, composite, hard tissue and polymeric samples, as well as most non-biological samples for many areas of microscopy.