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Characterizing Macroscopic Thermal Resistance Across Contacting Interfaces Through Local Understanding of Thermal Transport

Published online by Cambridge University Press:  23 July 2018

Seshu Nimmala
Affiliation:
Lam Research Corporation
S. Aria Hosseini*
Affiliation:
Department of Material Science and Engineering, University of California — Riverside
Jackson Harter
Affiliation:
School of Nuclear Science and Engineering, Oregon State University
Todd Palmer
Affiliation:
School of Nuclear Science and Engineering, Oregon State University
Eric Lenz
Affiliation:
Lam Research Corporation
P. Alex Greaney
Affiliation:
Department of Material Science and Engineering, University of California — Riverside
*
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Abstract

Thermal resistance across the interface between touching surfaces is critical for many industrial applications. We developed a network model to predict the macroscopic thermal resistance of mechanically contacting surfaces. Contacting interfaces are fractally rough, with small islands of locally intimate contact separated by regions with a wider gas filled boundary gap. Heat flow across the interface is therefore heterogeneous and thus the contact model is based on a network of thermal resistors representing boundary resistance at local contacts and the access resistance for lateral transport to contacts. Molecular dynamics simulations have been performed to characterize boundary resistance of Silicon Alumina interfaces for testing the sensitivity of thermal resistance to contact opening. Boltzmann transport simulations of access resistance in Si are conducted in the ballistic transport regime.

Type
Articles
Copyright
Copyright © Materials Research Society 2018 

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References

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