Hostname: page-component-77c89778f8-m8s7h Total loading time: 0 Render date: 2024-07-17T18:35:14.136Z Has data issue: false hasContentIssue false
  • English
  • Français

Materials for 3D Packaging of Electronic and Optoelectronic Systems

Published online by Cambridge University Press:  31 January 2011

Volkan H. Ozguz  and
James Yamaguchi
Get access

Abstract

Advanced three-dimensional (3D) packaging techniques for electronic components are promising for the realization of “systems-in-packages.” Three-dimensional packages require the use of a variety of materials within a small physical size range. Materials selection is therefore critical from electrical, optical, mechanical, structural, thermal, and manufacturability viewpoints. The materials combination depends also on the intended application for the 3D packaged modules. This article reviews 3D packaging approaches, materials classes, and examples. Three-dimensional packaged systems using judiciously selected materials offer performance advantages that cannot be provided by planar implementation.

Keywords

electronic materialsmicroelectronics packaging and integrationthree-dimensional (3D) packaging techniques
Type
Research Article
Information
MRS Bulletin , Volume 28 , Issue 1: Microelectronics Packaging and Integration , January 2003 , pp. 35 - 40
Copyright
Copyright © Materials Research Society 2003

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1.Al-Sarawi, S., Abbott, D., and Franzon, P., IEEE Trans. Components, Packag., Manuf. Technol., Part B 21 (1) (1998) p. 1.Google Scholar
2.Eide, F., U.S. Patent No. 4,956,694 (1990).Google Scholar
3.Val, C., in Proc. 16th IEEE/CPMT Int. Electronic Manufacturing Technology, Vol. 1 (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 1994) p. 387.Google Scholar
4.Frew, D., in Proc. SPIE, Vol. 1346 (SPIE—The International Society for Optical Engineering, Bellingham, WA, 1990) p. 34.Google Scholar
5.Minahan, J., Pepe, A., Some, R., and Suer, M., in Proc. 42nd Electronic Components and Technology Conf. (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 1990) p. 340.Google Scholar
6.Terrill, R. and Beene, G., in Proc. IEEE Aerospace Applications Conf., Vol. 2 (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 1996) p. 347.Google Scholar
7.Lea, R.M., Jalowiecki, I.P., Boughton, D.K., Yamaguchi, J., Pepe, A., Ozguz, V., and Carson, J.C., IEEE Trans. Adv. Packag. 22 (3) (1999) p. 424.Google Scholar
8.Ozguz, V. and Carson, J., in Proc. SPIE Optoelectronic Critical Review on Heterogeneous Integration, edited by Towe, E. (SPIE—The International Society for Optical Engineering, Bellingham, WA, 2000) p. 225.Google Scholar
9.Pence, W. and Krusius, P., IEEE Trans. Components, Hybrids, Manufac. Technol. CHMT-10 (1987) p. 176.Google Scholar
10.Ozguz, V., Marchand, P., and Liu, Y., in Proc. Int. Conf. on High-Density Interconnect and System Packaging (2000) p. 8.Google Scholar