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Silicon-on-lnsulator Technology: Past Achievements and Future Prospects

Published online by Cambridge University Press:  29 November 2013

Jean-Pierre Colinge
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Extract

In silicon-on-insulator (SOI) technology, devices are dielectrically insulated from one another—usually by silicon dioxide. Unlike in conventional silicon devices, there is no direct contact between a transistor and the silicon substrate. The advantages of this type of isolation are many: reduced parasitic capacitances and reduced crosstalk between devices, improved current drive, subthreshold characteristics, and current gain. Silicon-on-insulator devices have been and are being used in several niche-market applications such as hightemperature and radiation-hard integrated circuits. However most importantly, SOI technology seems perfectly adapted to the needs of low-voltage, low-power (LVLP) electronic circuits. Because of the growing market for portable systems, LVLP technology is bound to soon become one of the drivers of the microelectronics industry, and SOI is likely to be part of it. Moreover major companies such as IBM, Sharp, Motorola, and Peregrine have announced upcoming lowpower and high-frequency lines of SOI products. The goal of this article is to introduce the reader to the basics of SOI device physics and the integrated-circuit applications of SOI.

Type
Siucon-on-Insulator Technology
Information
MRS Bulletin , Volume 23 , Issue 12 , December 1998 , pp. 16 - 19
Copyright
Copyright © Materials Research Society 1998

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