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Activation Characteristics of Implanted Dopants in InAs, GaSb and GaP After Rapid Thermal Annealing

Published online by Cambridge University Press:  26 February 2011

A. R. Von Neida
Affiliation:
AT&T Bell Laboratories, Murray Hill, NJ 07974, USA
K. T. Short
Affiliation:
AT&T Bell Laboratories, Murray Hill, NJ 07974, USA
J. M. Brown
Affiliation:
AT&T Bell Laboratories, Murray Hill, NJ 07974, USA
S. J. Pearton
Affiliation:
AT&T Bell Laboratories, Murray Hill, NJ 07974, USA
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Abstract

We have studied in some detail the activation of implanted Si and Mg ions in InAs, GaSb and GaP after rapid thermal annealing. Even at doses of 1015 cm−2, the activation percentage of Mg is relatively high after optimum anneals -80% in GaP, 55% in GaSb and 45% in InAs. There is considerable outdiffusion of Mg in all three semiconductors for extended heat treatments. The amphoteric species Si shows good activation (60% for 1015 cm−2 dose) in InAs, a saturation electrically active concentration of ∼3 × 1013 cm−2 in GaP, and very low electrical activity in GaSb. The regrowth and damage removal characteristics in the three materials are similar to those of GaAs and InP.

Type
Research Article
Copyright
Copyright © Materials Research Society 1988

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References

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