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Adhesion and Thermal Deformation of Ceramic/ Polymer Heterostructures

Published online by Cambridge University Press:  15 February 2011

Cynthia Madras ,
Peter Y. Wong  and
Ioannis N. Miaoulis
Cynthia Madras
Affiliation:
Thermal Analysis of Materials Processing Laboratory, Mechanical Engineering Department, Tufts University, Medford, MA
Peter Y. Wong
Affiliation:
Thermal Analysis of Materials Processing Laboratory, Mechanical Engineering Department, Tufts University, Medford, MA
Ioannis N. Miaoulis
Affiliation:
Thermal Analysis of Materials Processing Laboratory, Mechanical Engineering Department, Tufts University, Medford, MA
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Abstract

The adhesion and thermal properties of optical ceramic structures bonded by a polymer interlayer are explored. The mechanical, adhesion and optical properties of the heterostructure are dependent on the thickness of the bond and on the residual thermal stresses developed during the bonding process. The thermomechanical properties of a bonded structure over a range of temperatures are investigated, focusing on the thermal expansion and operating temperature limits of the polymer bond. The temperature and stress histories during manufacturing are determined through both numerical modeling and experimental analysis. The effect of stress relaxation and initial stresses on the behavior of the bonding material are examined for different processing conditions. The bond material relaxation time constant, activation energy, viscosity, and shear modulus are approximated from observation of the temperature-dependent behavior of the structure.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 385: Symposium N – Polymer/Inorganic Interfaces II , 1995 , 71
Copyright
Copyright © Materials Research Society 1995

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References

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