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Adhesive Failure of a Thin Epoxy Film on an Aluminized Substrate

Published online by Cambridge University Press:  17 March 2011

N. R. Moody ,
D. F. Bahr ,
M. S. Kent ,
J. A. Emerson  and
E. D. Reedy Jr.
N. R. Moody
Affiliation:
Sandia National Laboratories, Livermore CA 94550
D. F. Bahr
Affiliation:
Washington State University, Pullman, WA 99164
M. S. Kent
Affiliation:
Sandia National Laboratories, Albuquerque, NM 87185
J. A. Emerson
Affiliation:
Sandia National Laboratories, Albuquerque, NM 87185
E. D. Reedy Jr.
Affiliation:
Sandia National Laboratories, Albuquerque, NM 87185
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Abstract

In this study we used nanoindentation to determine mechanical properties and combined nanoindentation with stressed overlayers to determine interfacial fracture energy of a 164 nm thick film of Epon 828/T403 on an aluminized glass substrate. The combination of nanoindentation and a tungsten overlayer was required to trigger delamination of the epoxy film from the aluminized substrate. Mechanics-based models for circular blister formation were then used to determine residual stresses and interfacial fracture energies. This approach showed that the tungsten overlayer had a compressive residual stress of 1.9 GPa which drove blister formation at a fracture energy of 1.9 J/m2 with a phase angle of loading equal to –62°.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 649: Symposium Q – Fundamentals of Nanoindentation & Nanotribology II , 2000 , Q6.3
Copyright
Copyright © Materials Research Society 2001

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References

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