Hostname: page-component-68945f75b7-qvshk Total loading time: 0 Render date: 2024-08-06T05:25:40.534Z Has data issue: false hasContentIssue false

Analytical Methodology and Design of Advanced Test Structure for the Mechanical Characteristics of Microactuator Materials

Published online by Cambridge University Press:  10 February 2011

Se-Ho Lee
Affiliation:
School of Materials Science and Engineering, Seoul National University, Seoul 151–742, Korea, dongilkgong.snu.ac.kr
Byung Woo Park
Affiliation:
School of Materials Science and Engineering, Seoul National University, Seoul 151–742, Korea, dongilkgong.snu.ac.kr
Yukeun Pak
Affiliation:
Micro Systems Lab.. Samsung Advanced Institute of Technology, Suwon 440–600, Korea, yepak'@saitgw.sait.samsung.co.kr
Dongil Kwon
Affiliation:
School of Materials Science and Engineering, Seoul National University, Seoul 151–742, Korea, dongilkgong.snu.ac.kr
Get access

Abstract

The electrostatic test structure was presented to measure the micromechanical properties of micromaterials as thin films forming the microactuators. The test structure was fabricated by using the surface micromachining processes and driven by the electrostatic force. In order to measure the fracture toughness, the sharp notch in the test structure was introduced by using the etching process. The displacement and deflection of the test structure under the electrostatic force was on the basis of the beam bending theory. An analytical model was proposed to evaluate the fracture toughness by experimental determination of crack propagation from the variations of capacitance and voltage. Additionally, an acceleration test for evaluation of the long-term reliability of the microactuator device was performed to predict the lifetime of a gold micromirror plane used in DVD (Digital Video Disk) by analyzing the resonant frequency and capacitance.

Type
Research Article
Copyright
Copyright © Materials Research Society 1999

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Petersen, K.E. and Gruarnieri, C.R., J. Appl. Phys., 50(11), 6761, (1979).Google Scholar
2. Ye, X.Y., Zhon, Z.Y., Yang, Y., Zhgang, J.H. and Yao, J., Sensors and Actuators A54, 750, (1996).Google Scholar
3. Kiesewetter, L. and Zhang, J.-M., Sensors and Actuators A35, 153, (1992).Google Scholar
4. Weppelmann, E. and Swain, M.V., Thin Solid Films, 286, 111, (1996).Google Scholar
5. Syms, R.R.A. and Lawes, R.A., Sensors and Actuators A63, 61, (1997).Google Scholar
6. Schiele, I., Huber, J., Hillerich, B. and Kozlowski, F., Sensors and Actuators A66, 345, (1998).Google Scholar
7. Ballarini, R., Mullen, R.L. and Yin, Y., J. Mater. Res., 12(4), 915, (1997).Google Scholar
8. Murakami, S., Stress Intensity Factors Handbook, 1, (1987), p. 13.Google Scholar
9. Connally, J.A. and Brown, S.B., Science, 256, 1537, (1992).Google Scholar