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Anisotropy in Thermal, Electrical and Mechanical Properties of Spin-Coated Polymer Dielectrics
Published online by Cambridge University Press: 22 February 2011
Abstract
In MCM-D applications, interlayer dielectrics separate and insulate metal conductors to form a three-dimensional interconnection structure. Due to the three-dimensional nature of these structures, the thermal, electrical and mechanical properties of the dielectricmaterials must be known for all orientations in order to correctly design and simulate devices. The most commonly used polymer in microelectronics, polyimide, exists in formulations which have been shown to have a high degree of orientation and exhibit anisotropicproperties.
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